会议信息

HOT CHIPS 2026: Symposium on High Performance Chips

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截稿日期:
2026-03-29
通知日期:
2026-05-02
会议日期:
2026-08-23
会议地点:
Stanford, California, USA
届数:
38
CCF: B   CORE: A   浏览: 63136   关注: 26   参加: 3

征稿

HOT CHIPS 2026 (Symposium on High Performance Chips) is a CCF B / CORE A conference held in Stanford, California, USA on 2026-08-23. The paper submission deadline is 2026-03-29. Acceptance notifications are sent on 2026-05-02.

Areas of InterestPermalink General-Purpose Processor Chips High-Performance, Low-Power Multi-Core and Highly-Reliable Systems Domain-Specific Chips AI Accelerators Graphics Chips Machine Learning Chips Data Analytics and Big Data Processing IoT and Always-On Functions Custom Chips for Emerging Applications Reconfigurable Chips FPGAs and FPGA-Based Systems Coarse-Grained Reconfigurable Arrays Security Secure Hardware Hardware Support for Software Security Mobile and Embedded Devices Graphics/Multimedia/Gaming SoC, Security, and DSP Chips Communications and Networking Wireless LAN/WAN/PAN Network and I/O Processors Emerging Computing Architectures Neuromorphic Quantum Computing Analog Computing, Photonic Chips Memory Technologies Emerging Memory Packaging, 3D, Stacked Other Enabling Technologies Power and Thermal Management Sustainable Computing Generative Tools Packaging and Testing Display Technologies On-Chip Optics & Sensors Novel Computing Technologies Software and Systems for Emerging Hardware Programming Models, Runtime Systems Performance, Power, Debug, and Evaluation
由 Dou Sun 最后更新于

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相关期刊

CCF全称影响因子出版商ISSN
BSoftware & Systems Modeling3.2Springer1619-1366
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