Conference Information
HotI 2026: IEEE Symposium on High-Performance Interconnects, Hot Interconnects
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Conference Partner Index (CP-I)
#74 of 342 in Systems & Architecture
| Academic recognition (35%) |
|
68 |
| Submission selectivity (20%) | No data - scored at the neutral baseline of 50 | — |
| Editions held (20%) |
|
95 |
| Community attention (10%) |
|
51 |
| Public record completeness (15%) |
|
55 |
Inputs used: Listed as CCF C, QUALIS B2 · Editions on record: 33 · Researchers following it here: 31 · Researchers who opened this page in the past 24 months: 10
Missing from the public record:
Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score
Confidence 80% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.2 · Computed 2026-11-07
Researchers at these institutions track this conference
Institute of Computing Technology, Chinese Academy of Sciences
Tsinghua UniversityBased on the institution researchers enter on their own profiles. We do not verify it.
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Based on the previous edition, the next deadline is estimated around 2027-05.
Call For Papers
HotI 2026 (IEEE Symposium on High-Performance Interconnects, Hot Interconnects) is a CCF C / QUALIS B2 conference held in Online on 2026-08-19. The paper submission deadline is 2026-05-20 (extended). Acceptance notifications are sent on 2026-06-26.
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