会议信息

Hot Interconnects 2025: Symposium on High-Performance Interconnects

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截稿日期:
2025-05-25 Extended
通知日期:
2025-06-27
会议日期:
2025-08-20
会议地点:
Online
届数:
32
CCF: c   QUALIS: b2   浏览: 40800   关注: 31   参加: 5

征稿

Hot Interconnects 2025 (Symposium on High-Performance Interconnects) is a CCF C / QUALIS B2 conference held in Online on 2025-08-20. The paper submission deadline is 2025-05-25 (extended). Acceptance notifications are sent on 2025-06-27.

IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core, on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia. Topics of InterestPermalink Systems software for communication Novel and innovative interconnect architectures Accelerator interconnects, e.g. NVLINK, Infinity Fabric Network software/hardware designed for AI/ML workloads Multi-core processor interconnects System-on-Chip Interconnects Chiplet-interconnect technologies such as UCIe and BOW Advanced chip-to-chip communication technologies Optical interconnects Protocol and interfaces for inter-processor communication Survivability and fault-tolerance of interconnects High-speed packet processing engines and network processors System and storage area network architectures and protocols High-performance host-network interface architectures High-bandwidth and low-latency I/O Pb/s switching and routing technologies Innovative architectures for supporting collective communication Novel communication architectures to support cloud & grid computing Centralized and distributed cloud interconnects Requirements driving high-performance interconnects Traffic characterization for HPC systems and commercial data centers Software-defined networking and software overlay networks Software for network bring-up, configuration and performance management (OpenFlow, OpenSM) Data Center Networking
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CCF全称影响因子出版商ISSN
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