IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core, on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia.

Topics of InterestPermalink

    Systems software for communication
    Novel and innovative interconnect architectures
    Accelerator interconnects, e.g. NVLINK, Infinity Fabric
    Network software/hardware designed for AI/ML workloads
    Multi-core processor interconnects
    System-on-Chip Interconnects
    Chiplet-interconnect technologies such as UCIe and BOW
    Advanced chip-to-chip communication technologies
    Optical interconnects
    Protocol and interfaces for inter-processor communication
    Survivability and fault-tolerance of interconnects
    High-speed packet processing engines and network processors
    System and storage area network architectures and protocols
    High-performance host-network interface architectures
    High-bandwidth and low-latency I/O
    Pb/s switching and routing technologies
    Innovative architectures for supporting collective communication
    Novel communication architectures to support cloud & grid computing
    Centralized and distributed cloud interconnects
    Requirements driving high-performance interconnects
    Traffic characterization for HPC systems and commercial data centers
    Software-defined networking and software overlay networks
    Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
    Data Center Networking