IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core, on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia.

Topics of InterestPermalink

Systems software for communication
Novel and innovative interconnect architectures
Accelerator interconnects, e.g. NVLINK, Infinity Fabric
Network software/hardware designed for AI/ML workloads
Multi-core processor interconnects
System-on-Chip Interconnects
Chiplet-interconnect technologies such as UCIe and BOW
Advanced chip-to-chip communication technologies
Optical interconnects
Protocol and interfaces for inter-processor communication
Survivability and fault-tolerance of interconnects
High-speed packet processing engines and network processors
System and storage area network architectures and protocols
High-performance host-network interface architectures
High-bandwidth and low-latency I/O
Pb/s switching and routing technologies
Innovative architectures for supporting collective communication
Novel communication architectures to support cloud & grid computing
Centralized and distributed cloud interconnects
Requirements driving high-performance interconnects
Traffic characterization for HPC systems and commercial data centers
Software-defined networking and software overlay networks
Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
Data Center Networking