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ISPD 2023: International Symposium on Physical Design
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Call For Papers
 ACM International Symposium on Physical Design with a tribute to Professor Malgorzata Marek-Sadowska
March 26-29, 2023, Virtual

Sponsored by ACM SIGDA with technical co-sponsorship from IEEE CEDA

The International Symposium on Physical Design (ISPD) provides a premier forum to exchange ideas and promote innovative research in all aspects of physical design ranging from traditional topics for ASIC and FPGA designs to emerging technologies that impact physical design of integrated circuits (ICs). In 2023, ISPD will be online with virtual participation, with both live video and recorded sessions. The 32nd symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field.

Physical design topics of interest include but are not limited to:

Floorplanning and interconnect planning 	
Interactions with system and logic level design
Partitioning, placement, and routing 	
Timing and power estimation and modeling
Clock and power networks 	
Circuit analysis and optimization in a physical design context
Post layout and post-silicon optimization	
Data management, multi-threaded/distributed algorithm
Design for manufacturability and yield 	
Hot topics such as machine learning and hardware security
Physical synthesis 	
3D ICs, quantum circuits, and other emerging technologies 
Last updated by Dou Sun in 2022-09-10
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