会议信息
DATE 2023: Design, Automation and Test in Europe
https://www.date-conference.com/date-2023-call-papers
截稿日期:
2022-09-18
通知日期:
会议日期:
2023-04-17
会议地点:
Antwerp, Belgium
届数:
26
CCF: b   CORE: b   QUALIS: a1   浏览: 124584   关注: 131   参加: 21

征稿
Scope of the Event

The 26th DATE conference is the main European event bringing together designers and design automation users, researchers and vendors as well as specialists in hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts strong emphasis on both technology and systems, covering ICs/SoCs, emerging technologies, embedded systems and embedded software.

Structure of the Event

The multi-day event consists of a conference with keynote talks, regular papers, panels, hot-topic sessions, tutorials, workshops, special focus days and a track for executives. The scientific conference is complemented by a commercial exhibition showing the state-of-the-art in design and test tools, methodologies, IP and design services, reconfigurable and other hardware platforms, embedded software and (industrial) design experiences from different application domains, such as automotive, wireless, telecom and multimedia applications. The organisation of user group meetings, fringe meetings, a university booth, a PhD forum, vendor presentations and social events offers a wide variety of extra opportunities to meet and exchange information on relevant issues for the design automation, design and test communities. Special space will also be allocated for multi-partner innovative research projects to show their results. More details are available on the DATE website: https://www.date-conference.com.

Areas of Interest

Within the scope of the conference, the main areas of interest are: design automation, design tools and hardware architectures for electronic and embedded systems; test and dependability at system, chip, circuit and device level for analogue and digital electronics; modelling, analysis, design and deployment of embedded software and cyber-physical systems; application design and industrial design experiences. Topics of interest include, but are not restricted to:

    System Specification and Modelling
    System-level Design Methodologies and High-Level Synthesis
    System Simulation and Validation
    Design and Test for Analog and Mixed-Signal Circuits and Systems, and MEMS
    Design and Test of Hardware Security Primitives
    Design and Test of Secure Systems
    Formal Methods and Verification
    Network-on-Chip and on-chip Communication
    Architectural and Microarchitectural Design
    Low-power, Energy-efficient and Thermal-aware Design
    Approximate Computing
    Reconfigurable Systems
    Logical and Physical Analysis and Design
    Emerging Design Technologies for Future Computing
    Emerging Design Technologies for Future Memories
    Power-efficient and Sustainable Computing
    Smart Cities, Internet of Everything, Industry 4.0
    Automotive Systems and Smart Energy Systems
    Augmented Living and Personalized Healthcare
    Secure Systems, Circuits and Architectures
    Self-adaptive and Context-aware Systems
    Applications of Emerging Technologies
    Industrial Experiences
    Modelling and Mitigation of Defects, Faults, Variability and Reliability
    Test Generation, Test Architectures, Design for Test, and Diagnosis
    Dependability and System-Level Test
    Embedded Software Architectures, Compilers and Tool Chains
    Real-time, Dependable and Privacy-Enhanced Systems
    Machine Learning Solutions for Embedded and Cyber-Physical Systems
    Design Methodologies for Machine Learning Architectures
    Design Modelling and Verification for Embedded and Cyber-Physical Systems
最后更新 Dou Sun 在 2022-07-12
录取率
时间提交数录取数录取率(%)
200683426732%
200582517621.3%
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