Journal Information
Engineering Applications of Artificial Intelligence (EAAI)
Impact Factor:
Call For Papers
Artificial Intelligence (AI) techniques are now being used by the practicing engineer to solve a whole range of hitherto intractable problems. This journal provides an international forum for rapid publication of work describing the practical application of AI methods in all branches of engineering.

Focal points of the journal include, but are not limited to innovative applications of:

• Real-time intelligent automation, and their associated supporting methodologies and techniques, including control theory and industrial informatics,
• Architectures, algorithms and techniques for distributed AI systems, including multi-agent based control and holonic control,
• Decision-support systems,
• Aspects of reasoning: abductive, case-based, model-based, non-monotonic, incomplete, progressive and approximate reasoning,
• Applications of chaos theory and fractals,
• Metaheuristics and their applications in intelligent automation: Genetic Algorithms, Ant Colony Optimization, Particle Swarm Optimization, etc.,
• Knowledge processing, knowledge elicitation and acquisition, knowledge representation, knowledge compaction, knowledge bases, expert systems,
• Neural networks, fuzzy systems, neuro-fuzzy systems,
• Perception, e.g. image processing, pattern recognition, vision systems, tactile systems, speech recognition and synthesis,
• Aspects of software engineering, e.g. intelligent programming environments, verification and validation of AI-based software, software and hardware architectures for the real-time use of AI techniques, safety and reliability,
• Intelligent fault detection, fault analysis, diagnostics and monitoring,
• Self-organizing, emerging or bio-inspired system,
• Industrial experiences in the application of the above techniques, e.g. case studies or benchmarking exercises.

Engineering Applications of Artificial Intelligence publishes:
• Survey papers/tutorials.
• Contributed papers — detailed expositions of new research or applications.
• Case studies or software reviews — evaluative and descriptive reviews of existing available AI software systems, discussing the experience gained and lessons learnt from using or developing AI systems for engineering applications.
• IFAC EAAI Forum — problems arising from engineering practice, needing to be solved by somebody; solutions to problems discussed in this forum or elsewhere; critiques of a position or claim found in the literature. 
Last updated by Dou Sun in 2022-01-29
Special Issues
Special Issue on Artificial Intelligence for High-Performance Computing systems
Submission Date: 2024-06-15

High-performance computing (HPC) and artificial intelligence (AI) are increasingly being used together to solve complex problems. On the one hand HPC can be used to accelerate the training and deployment of machine learning (ML) models on HPC systems, while AI can also be used to optimize the performance of HPC systems themselves.Designing and implementing algorithms efficiently exploiting such complex and heterogeneous systems opens numerous research challenges. The aim of the « AI for HPC systems » special issue is thus to collect works addressing those, including (but not limited to) AI algorithms on GPU, TPU, FPGA; AI for energy efficient HPC and Cloud systems; real world applications of AI on HPC systems. Guest editors: Dr. Grégoire Danoy (Executive Guest Editor)University of Luxembourg, Esch-sur-Alzette, LuxembourgEmail: gregoire.danoy@uni.luAreas of Expertise: artificial intelligence, optimisation, metaheuristics, machine learning Dr. Didier El BazTeam SARA, LAAS-CNRS, Toulouse, FranceEmail: elbaz@laas.frAreas of Expertise: Parallel computing, distributed computing, optimization, machine learning Manuscript submission information: Tentative Schedule: First Submission Date: 27th October 2023 Final Submission Deadline: 15th June 2024 Notification of Acceptance: 30th July 2024
Last updated by Dou Sun in 2023-12-24
Special Issue on AI-Driven Innovations in Cyber-Physical Systems: Advancements, Challenges, and Ethical Considerations
Submission Date: 2024-12-13

The proposed special issue, titled "AI-Driven Innovations in Cyber-Physical Systems: Advancements, Challenges, and Ethical Considerations," aims to delve into the intricate relationship between Artificial Intelligence (AI) and Cyber-Physical Systems (CPS) across diverse domains. By gathering a variety of papers focusing on the intersection of AI and CPS, the issue will explore topics such as control systems, security, energy management, healthcare, manufacturing, and smart cities. This collection will highlight the dynamic synergy between AI and CPS, offering novel insights and pushing the boundaries of existing knowledge. With a focus on the rapid evolution of AI technologies within CPS and the inclusion of ethical considerations, this special issue aims to fill a void in the current research landscape. Aligned with the mission of the journal, the issue caters to a broad audience of researchers, practitioners, and policymakers interested in the interdisciplinary nature of AI and CPS. By addressing practical implications and ethical concerns, this collection seeks to provide valuable insights to professionals and academics alike. Overall, "AI-Driven Innovations in Cyber-Physical Systems" aims to contribute significantly to the field while resonating with the readership of the journal. Guest editors: Assist. Prof. Antonio Galli (Executive Guest Editor) Department of Electrical Engineering and Information Technologies, University of Naples, Italy Email: Areas of Expertise: deep learning and big data analytics for industrial applications Prof. Vincenzo Moscato Department of Electrical Engineering and Information Technologies, University of Naples, Italy Email: Areas of Expertise: multimedia, knowledge management and big data analytics Prof. Mouzhi Ge Deggendorf Institute of Technology, Germany Email: Areas of Expertise: big data analytics, intelligent healthcare systems, internet of things and recommender systems Manuscript submission information: Tentative Schedule: Submission Open Date: June 13, 2024 Submission Deadline: December 13, 2024 Notification of Acceptance: January 31, 2025
Last updated by Dou Sun in 2024-05-12
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