会议信息
EMSOFT 2024: International Conference on Embedded Software
https://esweek.org/emsoft/
截稿日期:
2024-03-24
通知日期:
2024-07-14
会议日期:
2024-09-29
会议地点:
Raleigh, North Carolina, USA
届数:
24
CCF: b   CORE: a   QUALIS: a2   浏览: 43758   关注: 32   参加: 8

征稿
EMSOFT (ACM SIGBED International Conference on Embedded Software) aims at advancing the science and engineering of embedded software. Since 2001, EMSOFT has been at the forefront of embedded software innovation, connecting academia, industry, and government. At EMSOFT, cutting-edge research meets practical application in designing and analyzing software that brings the digital and physical worlds together. EMSOFT’s tradition is at the heart of cyber-physical systems, where computation, networking, and physical dynamics converge.

We invite submissions on all aspects of embedded software systems, including but not limited to:

    Embedded distributed, networked systems
        Time-critical embedded systems;
        Multi-/many-core processors, hardware accelerators;
        Embedded operating systems and middleware;
        Scheduling, resource allocation, and execution time analysis;
        QoS management and performance analysis;
        Hardware and software co-design.
    Embedded software design and analysis
        Energy-efficient embedded software;
        Safety/Mixed-critical embedded software;
        Software design and analysis for cyber-physical systems;
        Embedded software architectures for data-intensive applications and signal processing.
    Cyber-security, safety, and resilience
        Embedded software security and privacy;
        Safety mechanisms and methods for embedded software;
        Robust implementation of control systems.
    Process and methods
        Formal modeling and verification;
        Testing, validation, and certification;
        Model- and component-based approaches;
    Empirical studies and their reproduction
    Sustainability and energy sobriety
    Application areas including automotive, avionics, energy, health care, mobile devices, multimedia, machine learning, and autonomous systems
最后更新 Dou Sun 在 2024-03-07
录取率
时间提交数录取数录取率(%)
2006943133%
2005882528.4%
20041183025.4%
2003602033.3%
2002441738.6%
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相关期刊
CCF全称影响因子出版商ISSN
Statistical MethodologyElsevier1572-3127
Composites Communications6.500Elsevier2452-2139
First MondayUniversity of Illinois1396-0466
IEEE Open Journal of Circuits and Systems2.600IEEE2644-1225
Information Fusion14.70Elsevier1566-2535
bComputers & Security4.800Elsevier0167-4048
Information Technology and Management2.300Springer1385-951X
cThe Journal of Supercomputing2.500Springer0920-8542
cLogical Methods in Computer Science Logical Methods in Computer Science1860-5974
Journal of Cyber Security and MobilityRiver Publishers2245-1439
全称影响因子出版商
Statistical MethodologyElsevier
Composites Communications6.500Elsevier
First MondayUniversity of Illinois
IEEE Open Journal of Circuits and Systems2.600IEEE
Information Fusion14.70Elsevier
Computers & Security4.800Elsevier
Information Technology and Management2.300Springer
The Journal of Supercomputing2.500Springer
Logical Methods in Computer Science Logical Methods in Computer Science
Journal of Cyber Security and MobilityRiver Publishers
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