Información de la conferencia

SIES 2024: International Symposium on Industrial Embedded Systems

Por favor Iniciar sesión para ver el sitio web de la conferencia
Cuenta gratuita: consulta los sitios oficiales, sigue las fechas límite y recibe recordatorios por correo.
Insertar insignia de cuenta atrás
SIES
Día de Entrega:
2024-06-25 Extended
Fecha de Notificación:
2024-07-28
Fecha de conferencia:
2024-10-23
Ubicación:
Chengdu, China
Ediciones:
14
QUALIS: B3   Vistas: 28282   Seguidores: 3   Asistentes: 0

Solicitud de Artículos

SIES 2024 (International Symposium on Industrial Embedded Systems) is a QUALIS B3 conference held in Chengdu, China on 2024-10-23. The paper submission deadline is 2024-06-25 (extended). Acceptance notifications are sent on 2024-07-28.

Topics of interest include, but are not limited to (flyer download): Embedded Systems Design and Validation of Embedded Systems Real-Time Systems Real-Time Artificial Intelligence and Machine Learning Models of Embedded Computation Design and Verification Languages Operating Systems and Scheduling Timing and Performance Analysis Design Space Exploration Virtualization Technologies QoS Mechanisms for Virtualization Energy and Power Aware Embedded Computing Fault Tolerance & Dependability Adaptive Embedded Systems Cyber-Security for Embedded Systems System-on-Chip and Network-on-Chip Design & Testing Design of Application-Specific Instruction-Set Processors Design and Programming of Embedded Multiprocessors SoC Communication and Architectures RISC-V and Open Hardware NoC Communication and Architectures Design of SoC/NoC Platform-Based Design for Embedded Systems Reconfigurable Platforms Multiprocessor SoC Platforms and Tools Testing of Embedded Core-based Integrated Circuits Hardware Security Networked Embedded Systems and Edge Computing Embedded AI Design Issues for Networked Embedded Middleware Frameworks AI at the edge Resource Scheduling and Orchestration in Distributed Systems Self Adaptive Networked Entity Sensor Networks Time-Sensitive Networks and 5G/6G-enabled Embedded Systems End-to-End Latency Guarantees in the Edge-to-Cloud Continuum Methodologies for Performance-Aware Functional Decomposition between Cloud and Edge Safety, Security, and Real-Time Performance in Distributed Applications Embedded Applications Cyber-physical systems and Internet of Things, including Industrial Automation and Controls Automotive Applications and Autonomous Driving Intelligent Transportation Systems Smart Home Wireless Health Care Industrial Building Automation and Control Real-Time Edge Computing Use Cases
Última actualización por Dunn Carl el

Conferencias Relacionadas

CCFICOREAbreviaciónNombre CompletoEntregaNotificaciónFecha de conferencia
AA*SIGIRInternational Conference on Research and Development in Information Retrieval2026-01-152026-04-022026-07-20
AA*AAAIAAAI Conference on Artificial Intelligence2026-07-212026-11-302027-02-16
AA*CVPRIEEE Conference on Computer Vision and Pattern Recognition2025-11-062026-02-202026-06-03
BA*ICRAInternational Conference on Robotics and Automation2027-05-24
BA*IJCAIInternational Joint Conference on Artificial Intelligence2026-01-312026-08-15
AA*STOCACM Symposium on Theory of Computing2025-11-042026-02-012026-06-22
CICCInternational Conference on Communications2026-10-022027-01-152027-05-30
CBIJCNNInternational Joint Conference on Neural Networks2027-01-312027-03-152027-06-14
BICASSPInternational Conference on Acoustics, Speech and Signal Processing2026-09-162027-01-132027-05-16
BA*PODSACM SIGMOD Conference on Principles of DB Systems2026-12-032027-03-012027-06-13

Revistas Relacionadas

CCFNombre CompletoFactor de ImpactoEditorISSN
Design Automation for Embedded Systems0.9Springer0929-5585
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems6.1Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
BPattern Recognition7.6Elsevier0031-3203
IEEE Access3.6IEEE2169-3536

Comentarios 0

Aún no hay comentarios.

Por favor Iniciar sesión para publicar un comentario