Conference Information
SEC'' 2024: ACM/IEEE Symposium on Edge Computing
http://acm-ieee-sec.org/2024/Submission Date: |
2024-06-14 |
Notification Date: |
2024-09-20 |
Conference Date: |
2024-12-04 |
Location: |
Rome, Italy |
Years: |
9 |
Viewed: 23091 Tracked: 11 Attend: 3
Call For Papers
SEC takes a broad view of edge computing and solicits contributions from many fields of systems practice that embrace any aspect of edge computing. Topics include, but are not limited to: communication infrastructure (e.g., cellular, satellite, LoRa) for edge computing distributed ledger technology (DLT) & blockchain at the edge socio-economic aspects of edge computing edge computing as an enabler of 5G applications and services edge computing infrastructure (e.g., IoT hubs) and its sustainability emerging applications at the edge, such as the metaverse, smart environments, and remote sensing geo-distributed analytics and indexing on edge nodes hardware architectures for edge computing and devices monitoring, measurements, management, and diagnosis in edge computing networking, e.g., from clients to the edge, and from the edge to the cloud programming models and toolkits resource management, scalability, and reliability for edge computing security and privacy issues storage and data management technologies for edge computing techniques and algorithms for machine learning and AI at the edge edge-enabled applications, such as in vehicular, enterprise, and manufacturing systems Submissions that include systems implementation and their performance evaluation are particularly encouraged. The review process will be double-blind. Papers will be judged on novelty, significance, clarity, relevance, and correctness. A best paper award will be presented to one or more outstanding papers from the conference. We also welcome short Position Papers on any of the above topics, which will be judged separately from papers in the research track of the conference. By submitting a paper, you agree that at least one of the authors will attend the conference to present it. Papers must be in PDF format and must be submitted through: https://sec24.hotcrp.com/. No email submissions will be accepted.
Last updated by Dou Sun in 2024-05-14
Related Conferences
Short | Full Name | Submission | Conference |
---|---|---|---|
SCNLP | Asia Conference on Soft Computing and Natural Language Processing | 2023-07-15 | 2023-07-28 |
GMEE | International Conference on Green Materials and Environmental Engineering | 2020-12-28 | 2021-02-02 |
ICIIT | International conference on Intelligent Information Technologies | 2024-09-30 | 2025-02-20 |
CDICS | International Conference on Data, Information and Computing Science | 2024-11-05 | 2024-12-06 |
SAI' | International Conference on Soft Computing, Artificial Intelligence and Applications | 2023-03-11 | 2023-03-25 |
HPCC | International Conference on High Performance Computing and Communications | 2025-03-15 | 2025-06-26 |
ADBIS | European Conference on Advances in Databases and Information Systems | 2024-04-15 | 2024-08-28 |
SOCC | ACM Symposium on Cloud Computing | 2024-07-08 | 2024-11-20 |
JIST | The Joint International Semantic Technology Conference | 2019-08-10 | 2019-11-25 |
CTCNet | Asia Pacific Conference on Computing Technologies, Communications and Networking | 2024-07-05 | 2024-07-26 |
Related Journals
CCF | Full Name | Impact Factor | Publisher | ISSN |
---|---|---|---|---|
Advances in Data Analysis and Classification | 1.400 | Springer | 1862-5347 | |
IEEE Transactions on Haptics | 2.400 | IEEE | 1939-1412 | |
Ethics and Information Technology | 3.400 | Springer | 1388-1957 | |
Journal of Digital Imaging | 2.900 | Springer | 0897-1889 | |
c | Multimedia Systems | 3.500 | Springer | 0942-4962 |
Interaction Studies | 0.900 | John Benjamins Publishing Company | 1572-0373 | |
Active and Passive Electronic Components | 1.300 | Hindawi | 0882-7516 | |
c | BMC Bioinformatics | 2.900 | BioMed Central | 1471-2105 |
b | ACM Transactions on Embedded Computing Systems | 2.800 | ACM | 1539-9087 |
Full Name | Impact Factor | Publisher |
---|---|---|
Advances in Data Analysis and Classification | 1.400 | Springer |
IEEE Transactions on Haptics | 2.400 | IEEE |
Ethics and Information Technology | 3.400 | Springer |
Journal of Digital Imaging | 2.900 | Springer |
Multimedia Systems | 3.500 | Springer |
Interaction Studies | 0.900 | John Benjamins Publishing Company |
Active and Passive Electronic Components | 1.300 | Hindawi |
BMC Bioinformatics | 2.900 | BioMed Central |
ACM Transactions on Embedded Computing Systems | 2.800 | ACM |
Recommendation