In 2017, the IEEE International Interconnect Technology Conference (IITC) will be held in Hsinchu, Taiwan. This is the first IITC held in Taiwan.
 
The 20th annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.
 
IITC is issuing a Call for Papers for work describing innovative developments in the critically important field of interconnections for electronic systems. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of abstracts is February 1, 2017.  
 
IITC 2017 will be held May 16-18, 2017 at the Ambassador Hotel in Hsinchu, Taiwan. The conference attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development.

Applications of Interest

    Advanced interconnects: Low-k interconnects, optical, wireless, and carbon-based interconnects, beyond Cu…
    Contact on MOS devices: Silicide, III-V, 2D materials…
    Memory architecture: CBRAM, PCRAM, OxRAM, MRAM, DRAM…
    3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, CPI…
    Novel System and Emerging Technology: Energy harvesting, brain-inspired computing…
    Novel Form Factors: flexible electronics, wearables… 

Topics of Interest

    Process integration, via/trench patterning
    Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, SAM, patterning…)
    Reliability and Failure analysis, techniques and methods
    Advanced material or process characterization, Design-Technology co-optimization, and modelling techniques
    Nano-materials

CONFERENCE FORMAT 

    Regular papers, up to 3-page abstracts, will be selected for either oral or poster presentation.  
    All submissions are rigorously reviewed.
    Abstracts for accepted papers will be published digitally by IEEE as IITC Conference Proceedings without the opportunity for further change. 

NOTE: Submission of an abstract for review and subsequent acceptance is considered by the committee as an agreement that the work will not be placed in the public domain by the author prior to the conference. Accepted papers or significant portions of the work may not be placed in the public domain prior to the conference. Violation will be grounds for automatic withdrawal of the paper by the conference committee. Inclusion of materials from publications by other authors may be done only with their expressed permission and with a citation associated with the reproduced material. Appropriate company or government clearance must be obtained by the authors before submission and an IEEE Copyright Form will be required.
 
Papers must be submitted electronically (Submit Paper).  Please read the Paper Submission Guidelines before preparing your paper.
 
ACCEPTED PAPERS WILL BE PRINTED IN THE PROCEEDINGS WITHOUT THE OPPORTUNITY FOR FURTHER CHANGE. Paper length inclusive of all illustrations, charts and tables must be 3 pages. Contact 

​Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference. Supplier seminars will be held on the 1st or 2nd evenings of the conference.   
For further details about paper submissions, supplier seminar opportunities or other aspects of the conference, please visit our web site (http://www.iitc-conference.org/ ) or contact Ms. Celia Shih at celia@tsia.org.tw