Conference Information
VTS 2024: VLSI Test Symposium
https://tttc-vts.org/public_html/new/2024/Submission Date: |
2023-10-09 |
Notification Date: |
2023-12-23 |
Conference Date: |
2024-04-22 |
Location: |
Tempe, Arizona, USA |
Years: |
42 |
CCF: c QUALIS: a2 Viewed: 18180 Tracked: 17 Attend: 1
Call For Papers
You are invited to participate and submit your contributions to VTS’24. The areas of interest include (but are not limited to) the following topics: VTS Topics Analog – Mixed-Signal – RF Test ATPG & Compression Silicon Debug Automotive Test & Safety Built-In Self-Test (BIST) Defect & Current Based Test Defect & Fault Tolerance Delay & Performance Test Design for Testability – Yield or Reliability Pre-silicon Design Verification & Validation Post-silicon Validation Hardware Security Embedded System & Board Test Embedded Test Methods Emerging Technologies Test and Reliability Fault Modeling and Simulation Low-Power IC Test Machine Learning in Test – Yield and Reliability Microsystems/MEMS/Sensors Test Memory Test and Repair 2.5D – 3D & SiP Test Yield Optimization On-Line Test & Error Correction Power & Thermal Issues in Test System-on-Chip (SOC) Test Test & Reliability of Biomedical Devices Test & Reliability of High-Speed I/O Test & Reliability of Machine Learning Systems Test Quality & Reliability Test Standards & Economics Test Resource Partitioning Transient & Soft Errors FPGA Test
Last updated by Dou Sun in 2023-09-16
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ISR | International Symposium on Robotics | 2018-06-20 | |
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Full Name | Impact Factor | Publisher |
---|---|---|
International Journal of Wireless Communication and Sensor Network | ISIBS | |
Computer Methods in Biomechanics and Biomedical Engineering: Imaging & Visualization | Taylor & Francis | |
ICT Express | 4.317 | Elsevier |
International journal of VLSI Design & Communication Systems | AIRCC | |
Sensors | 3.031 | MDPI |
Mobile Information Systems | 0.849 | Hindawi |
Journal of Electronic Testing | 0.454 | Springer |
SIGMOD Record | ACM | |
International Journal of Computational Science and Engineering | Inderscience | |
Symmetry | 2.645 | MDPI |
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