ITC invites submissions on the latest advances in test, validation, diagnosis, implementation, and scalability for ICs, boards, and systems, covering cross-domain, test economics, and product lifecycle challenges.

Topics of interest include, but not limited to

Test Methodologies & Technologies
• Adaptive Test in Practice
• ATE & Probe Card Design
• Built-In Self-Test (BIST)
• Boundary Scan & JTAG
• Design for Test (DFT) & DFM
• Mixed-Signal & Analog Test
• Memory Test & Repair
• MEMS Testing
• Power Issues in Test
• High-Speed I/O, RF & Jitter Test
• Test Compression & Optimization
• Test Generation & Validation

Industrial Case Study, System, & Application Specific Test
• 3D/2.5D & Advanced Packaging
• SoC/NoC Test
• 5G/6G Test
• Hardware Security & Trust
• Automotive Test
• IoT Test
• System Test
• Silicon case studies

Verification, Debug & Analysis
• Pre-Silicon/Post-Silicon Verification
• Silicon Debug & Field Monitoring
• Diagnosis & Defect Analysis
• Data-Driven Test & End-to-End Analytics
• Yield Analysis & Optimization
• Test-to-Design Feedback & Escape Analysis

Emerging Topics
• Reliability & Resilience
• Emerging Defect Mechanisms
• Protocol-Aware Test
• Optics & Photonics Test
• AI/Machine Learning in Test
• Quantum Device Testing
• KGD/KGS/KGP Economics
• New Technologies & Standards