ITC invites submissions on the latest advances in test, validation, diagnosis and security of IPs, ICs, boards and systems.

Topics of interest include, but not limited to:

3D/2.5D Test
5G/6G Test
Adaptive Test in Practice
AI/Machine Learning in Test
ATE/Probe Card Design
Automotive Test
Advances in Boundary Scan
Built-In Self-Test
Data Driven Test Methods
Defect-oriented Testing
Design for Test
DFM and Test
Diagnosis
Economics of Test
End-to-End Data Analysis
End-to-End System Security
Emerging Defect Mechanisms
Field Monitoring, Test, & Debug
Hardware Security and Trust
IoT Testing
Jitter, High-Speed I/O and RF Test
Known-Good-Die Test
Memory Test and Repair
MEMS Testing
Mixed-Signal and Analog Test
New Technologies and Test
Online Test
Pre-Silicon/Post-Silicon Verification
Power Issues in Test
Protocol-aware Test
Quantum Device Testing
Reliability and Resilience
SoC/SiP/NoC Test
Silicon Debug
Simulation and Emulation
System Test (Applications)
System Test (Hardware/Software)
Test Compression
Test-to-Design Feedback
Test Escape Analysis
Test Flow Optimizations
Test Generation and Validation
Test Resource Partitioning
Test Standards
Testing High Speed Optics/Photonics
Timing Test
Yield Analysis and Optimization