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HSIC 2016: International High Speed Intelligent Communication

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HSIC
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截稿日期:
2016-05-31
通知日期:
2016-06-30
会议日期:
2016-09-07
会议地点:
Taipei, Taiwan
届数:
8
浏览: 18637   关注: 0   参加: 0

会伴指数 (CP-I)

43.9 / 100
全站第 3,161 名 / 共 5,647 个会议 · 前 56%

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学术认可 (35%) 无数据 —— 按中性基准 50 分计入
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入
会议传承 (20%)
59
社区关注 (10%)
8
资料公开度 (15%)
25

用到的输入: 有据可查的届次:8 · 过去 24 个月打开过本页的研究者:2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-03

征稿

HSIC 2016 (International High Speed Intelligent Communication) is an academic conference held in Taipei, Taiwan on 2016-09-07. The paper submission deadline is 2016-05-31. Acceptance notifications are sent on 2016-06-30.

HSIC General Topics Optical Transmission Systems Optical Signal Processing Radio-Over-Fiber Systems Signal Processing and Its Applications Power and Control Systems Bioelectronics and E-Care Passive Millimeter Circuits and Antennas Advanced microwave integrated circuits Advanced Communication Circuits and Systems Smart Network Communication System Energy-Performance Optimization of Network Devices Big Data and Social Network Cyber-Physical Systems (CPS) and Internet-of-Things (IoT) Publication All accepted papers will be invited to submit to the IEEE Xplore database with Engineering Index (EI) or special issues of following Science Citation Index (SCI) journals as follows: AEU - International Journal of Electronics and Communications (IF=0.601) Authors at IEEE HSIC & ICCP 2016 are invited to submit an expanded version of their papers to the Special Issue of IJEC. Please download the Cover Letter and submit it together with your paper to the IJEC website. The submissions must give at least 50% of new contents. The conference paper also must be attached to allow our reviewers to check. Please prepare your manuscript according to standard standard Author Guide. Every paper will be reviewed by IJEC in the same manner as all other regular submissions to this publication. The deadline for submitting your manuscript is November 15, 2016
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