Conference Information
APCC 2022: Asia-Pacific Conference on Communications
http://apcc2022.org/Submission Date: |
2022-05-31 |
Notification Date: |
2022-07-20 |
Conference Date: |
2022-10-19 |
Location: |
Jeju Island, Korea |
Years: |
27 |
CORE: b Viewed: 27158 Tracked: 9 Attend: 0
Call For Papers
The 27th Asia-Pacific Conference on Communications (APCC 2022) will be held at Ramada Plaza Jeju Hotel in world-renowned beautiful Jeju Island, Korea, during October 19-21, 2022. Since 1993, APCC has been a technical forum for researchers and engineers to interact and disseminate information on the latest developments in advanced communication and information technologies. In this year, APCC 2022 will be co-located with ICTC 2022 (International Conference on ICT Convergence).Prospective authors are invited to submit original technical papers for presentation at the conference and publication in the conference proceedings. Potential topics are solicited in, but not limited to the following topics: Artificial Intelligence and Machine Learning in Communications Ad hoc and sensor networks Antennas and propagations Broadband wireless access Cognitive radio and networks Communication protocol and architecture Communication theory Communication and Information Systems Security Communication Software, Services and Multimedia Applications Cooperative communication and relaying Future Internet and networks Green communication systems and network Information theory and channel coding IoT and Applications mmWave and THz Communications Mobility management Multimedia communications Multiple antenna techniques Network and information security Network applications and services Next Generation Technologies, Applications, Services and Networking Optical networks and systems QoS and resource management Satellite and space communications Signal processing for communications Switching and routing Wireless and mobile networks Wireless communications
Last updated by Dou Sun in 2022-01-02
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International Journal of Computational Geometry and Applications | World Scientific | |
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IEEE Solid-State Circuits Magazine | IEEE | |
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