Conference Information
ICCAD 2022: International Conference on Computer-Aided Design
Submission Date:
Notification Date:
Conference Date:
San Diego, California, USA
CCF: b   CORE: a   QUALIS: a1   Viewed: 65419   Tracked: 93   Attend: 9

Call For Papers
Original technical submissions on, but not limited to, the following topics are invited:


1.1 System Design

    System-level specification, modeling, and simulation
    System design flows and methods
    HW/SW co-design, co-simulation, co-optimization, and co-exploration
    HW/SW platforms for rapid prototyping
    HW/SW prototyping and emulation on FPGAs
    System-level design case studies and applications
    System-level issues for 3D integration
    Analysis and optimization of data centers
    Micro-architectural transformation
    Memory architecture and system synthesis
    System communication architecture
    Network-on-chip design methodologies
    Modeling and simulation of heterogeneous platforms
    High-level synthesis for heterogeneous computing
    Power/performance analysis of heterogeneous platforms
    Programming environment of heterogeneous computing
    Application driven heterogeneous platforms for big data, machine learning etc.
    Applications and designs for systems based on optical devices

1.2 Embedded Systems and Cyberphysical Systems (CPS) and Internet-of-Things (IoT)

    HW/SW co-design for embedded systems
    Multi-/Many-core processor, GPU and heterogeneous SoC for embedded systems
    Static and dynamic reconfigurable architectures
    Domain-specific accelerators
    Memory hierarchies and management
    System-level consideration of custom storage architectures
    Energy/power management and energy harvesting
    AI and machine learning for embedded systems
    CAD for IoT
    Security, privacy, reliability for IoT
    Edge and fog computing
    Modeling and analysis of CPS systems
    Dependable, safe, and secure CPS systems design
    Green computing (smart grid, energy, solar panels, etc.)
    CAD for application domains including wearables, health care, autonomous systems, smart cities

1.3 Neural Network and Deep Learning

    Hardware and architecture for  neural networks
    Compilers for deep neural networks
    Design method for learning on a chip
    System-level design for (deep) neural computing
    Neural network acceleration techniques including GPGPU, FPGA and dedicated ASICs
    Safe and secure machine learning
    Hardware accelerators for Artificial Intelligence

1.4 Neuromorphic Computing

    Network and neuron models
    Devices and hardware implementations
    Non-von Neumann architectures
    Event or spike-based hardware systems
    CAD for bio-inspired and neuromorphic systems

1.5 Embedded Software

    Real-time software and operating systems
    Scheduling and execution time analysis
    Middleware, virtual machines, runtime support, and resource management
    Profiling and compilation techniques
    Software synthesis, testing, validation, verification, and optimization
    Software design for multicores, GPUs, and heterogeneous embedded architectures
    Software for safe autonomy
    Energy-efficient embedded software

1.6 Hardware Security 

    Hardware Trojans, side-channel attacks, fault attacks and countermeasures
    Detection and prevention of hardware Trojans
    New physical attack vectors or methods for ASICs and FPGAs
    Nanoelectronic security
    Hardware-based security (CAD for PUF’s, RNG, AES etc.)
    Artificial Intelligence for attack prevention systems
    Design and CAD for security
    Security implications of CAD

1.7 Security Architecture and Systems

    Embedded software forensics
    Embedded software security
    Trustworthy embedded software
    Trusted execution environments
    Cache-side channel attack and mitigation
    Privacy-preserving computation
    Cloud Computing data security
    Internet-of-Things security
    Automotive/autonomous system security
    FPGA and reconfigurable fabric security
    Sensor network security
    Split Manufacturing for security
    Supply chain security and anti-counterfeiting

1.8 Security Architecture and Systems

    Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems
    Energy- and thermal aware application mapping and scheduling
    Energy- and thermal-aware architectures, algorithms, techniques
    Energy- and thermal-aware dark silicon system design and optimization
    Run-time management for the dark silicon
    New hardware techniques for approximate/stochastic computing


2.1 High-Level, Behavioral, and Logic Synthesis and Optimization

    High-level/Behavioral/Logic synthesis
    Technology-independent optimization and technology mapping
    Functional and logic timing ECO
    Resource scheduling, allocation, and synthesis
    Interaction between logic synthesis and physical design

2.2 Testing, Validation, Simulation, and Verification

    High-level/Behavioral/Logic modeling and validation
    High-level/Behavioral/Logic simulation
    Formal, semi-formal, and assertion-based verification
    Equivalence and property checking
    Emulation and hardware simulation/acceleration
    Post-silicon functional validation
    Digital fault modeling and simulation
    Delay, current-based, low-power test
    ATPG, BIST, DFT, and compression
    Memory test and repair
    Core, board, system, and 3D IC test
    Post-silicon validation and debug
    Analog, mixed-signal, and RF test

2.3 Cell-Library Design, Partitioning, Floorplanning, Placement

    Cell-library design and optimization
    Transistor and gate sizing
    High-level physical design and synthesis
    Estimation and hierarchy management
    2D and 3D partitioning, floorplanning, and placement
    Post-placement optimization
    Buffer insertion and interconnect planning
    Post-synthesis optimization for FPGAs

2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification

    2D and 3D clock network synthesis
    2D and 3D global and detailed routing
    Package-/Board-level routing and chip-package-board co-design
    Post-layout/-silicon optimization
    Layout and routing issues for optical interconnects


3.1 Design for Manufacturability and Design for Reliability

    Process technology characterization, extraction, and modeling
    CAD for design/manufacturing interfaces
    CAD for reticle enhancement and lithography-related design
    Variability analysis and statistical design and optimization
    Yield estimation and design for yield
    Physical verification and design rule checking
    DFM for emerging devices (3D, nanophotonics, non-volatile logic/memory, etc.)
    Machine learning for smart manufacturing and process control
    Analysis and optimization for device-level reliability issues (stress, aging effects, ESD, etc.)
    Analysis optimization for interconnect reliability issues (electromigration, thermal, etc.)
    Reliability issues related to soft errors
    Design for resilience and robustness
    Reliability issues for emerging devices (3D, optical, non-volatile, etc.)

3.2 Timing, Power and Signal Integrity Analysis and Optimization

    Deterministic and statistical static timing analysis and optimization
    Power and leakage analysis and optimization
    Circuit and interconnect-level low power design issues
    Power/ground network analysis and synthesis
    Signal integrity analysis and optimization

3.3 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling

    CAD for analog, mixed-signal, RF
    CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electrooptical) devices, circuits, and systems
    CAD for nanophotonics and optical devices
    FPGA-based prototyping for analog, mixed-signal, RF systems
    Analog, mixed-signal, and RF noise modeling and simulation
    Device, interconnect and circuit extraction and simulation
    Package modeling and analysis
    EM simulation and optimization
    Behavior modeling of devices and interconnect
    Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)


4.1 Biological Systems and Electronics, Brain Inspired Computing, and New Computing Paradigms

    CAD for biological computing systems
    CAD for systems and synthetic biology
    CAD for bio-electronic devices, bio-sensors, MEMS, and systems

4.2 Nanoscale and Post-CMOS Systems

    New device structures and process technologies
    New memory technologies (flash, phase change memory, STT-RAM, memristor, etc.)
    Nanotechnologies, nanowires, nanotubes, graphene, etc.
    Quantum computing
    Optical devices, computing, and communication
Last updated by Dou Sun in 2022-01-28
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