Conference Information
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/Submission Date: |
2024-01-31 |
Notification Date: |
2024-06-01 |
Conference Date: |
2024-06-11 |
Location: |
Tampere, Finland |
Years: |
8 |
Viewed: 1724 Tracked: 0 Attend: 0
Call For Papers
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
Last updated by Dou Sun in 2023-12-04
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| Full Name | Impact Factor | Publisher |
|---|---|---|
| Journal of Advanced Manufacturing Systems | World Scientific | |
| Journal of Computational Biology | Mary Ann Liebert | |
| Brain Sciences | 2.700 | MDPI |
| IET Software | 1.500 | IET |
| Multibody System Dynamics | 2.600 | Springer |
| ACM Transactions on Accessible Computing | 2.500 | ACM |
| ACM Transactions on Design Automation of Electronic Systems | 2.200 | ACM |
| Optical Materials | 3.800 | Elsevier |
| IEEE Journal of Selected Topics in Signal Processing | 8.700 | IEEE |
| Engineering Applications of Artificial Intelligence | 7.500 | Elsevier |
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