Topic 1: Electronic Technology

3D process and integration technology
Substrate embedding and advanced flip chip packaging
MEMS and sensor technology
Wafer-level CSP and heterogeneous integration
Design and Analysis of Transmission System
New materials, equipment and 3D interconnection
Wearable, flexible and stretchable electronics
Optical interconnection and 3D photonics
Digital system and logic design
Computer architecture and VLSI
Network-driven multi-core chip
Advanced robotic system
Motor
Analog and digital electronics
Signals and Systems

Topic 2: Information and Communication

Electronic equipment
Satellite and Space Communications
Network and Information Security
Signal processing for wireless communication
Cognitive Radio and Software Radio
Optical networks and systems
Electromagnetic field theory
Antenna, propagation and transmission technology
Optical communication
Radar signal and data processing