Conference Information
TransAI 2023: International Conference on Transdisciplinary AI
https://www.transai.org/Submission Date: |
2023-07-22 Extended |
Notification Date: |
2023-08-15 |
Conference Date: |
2023-09-25 |
Location: |
Laguna Hills, California, USA |
Years: |
5 |
Viewed: 8659 Tracked: 2 Attend: 0
Call For Papers
Artificial Intelligence (AI) is concerned with computing technologies that allow machines to see, hear, talk, think, learn, and solve problems even above the level of human beings. On the one hand it allows data to be analyzed by real-time models that enable unprecedented levels of accuracy and efficiency. On the other hand it enables domain specific problem solving and knowledge discovery that cannot be easily done by humans. Transdisciplinary AI 2023 (TransAI 2023), technically sponsored by the IEEE Computer Society, is an international forum focusing on the interactions between artificial intelligence (AI) and other research disciplines. It consists of themes that each addresses the applications of AI to a specific research discipline as well as how domain specific applications may advance the research on AI. The TransAI themes academic research including, but are not limited to, the following: AI and computer science AI and education AI and humanities AI and medicine AI and agriculture AI and sciences AI and engineering AI and law AI and business The conference proceedings will be submitted to the IEEE Xplore® and/or IEEE Computer Society Press digital library. Distinguished quality papers presented at the conference will be selected for the best paper/poster awards and for publication in internationally renowned journals (SCI, EI, and/or Scopus indexed).
Last updated by Dou Sun in 2023-07-01
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a | IEEE Transactions on Computers | 3.600 | IEEE | 0018-9340 |
Physica D: Nonlinear Phenomena | 2.700 | Elsevier | 0167-2789 | |
IEEE Transactions on Computational Imaging | 4.200 | IEEE | 2573-0436 | |
New Review of Hypermedia and Multimedia | 1.400 | Taylor & Francis | 1361-4568 | |
International journal of VLSI Design & Communication Systems | AIRCC | 0976-1527 | ||
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Computers & Education | 8.900 | Elsevier | 0360-1315 | |
IEEE Communications Magazine | 8.300 | IEEE | 0163-6804 |
Full Name | Impact Factor | Publisher |
---|---|---|
IEEE Transactions on Computers | 3.600 | IEEE |
Physica D: Nonlinear Phenomena | 2.700 | Elsevier |
IEEE Transactions on Computational Imaging | 4.200 | IEEE |
New Review of Hypermedia and Multimedia | 1.400 | Taylor & Francis |
International journal of VLSI Design & Communication Systems | AIRCC | |
Combinatorial Chemistry & High Throughput Screening | Bentham | |
Numerical Heat Transfer, Part B: Fundamentals | 1.700 | Taylor & Francis |
Genetic Programming and Evolvable Machines | 1.700 | Springer |
Computers & Education | 8.900 | Elsevier |
IEEE Communications Magazine | 8.300 | IEEE |
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