会议信息
DSA 2023: International Conference on Dependable Systems and Their Applications
https://dsa23.techconf.org/截稿日期: |
2023-05-25 Extended |
通知日期: |
2023-07-10 |
会议日期: |
2023-08-10 |
会议地点: |
Tokyo, Japan |
届数: |
10 |
浏览: 20768 关注: 4 参加: 0
征稿
Topics of Interest
Algorithms, Architecture, Framework, Design Patterns, and Maintenance for Dependable Systems and Software
Security, Threats, Privacy, Safety, and Risk Management
Dependability and Reliability Modelling and Measurement
Fault Tolerance, Survivability, Resilience, and Availability
Metrics, Measurement, and Quality Assessment
Requirements, Process, Standards, Productivity, and Project Management
Quality Assurance, Maintenance, Reverse Engineering, and Re-Engineering
Verification, Validation, Testing, Analysis, Debugging, Model Checking, and Program Repair
Formal Methods and Theories
Communication, Networking, Optimization, and Performance
Pervasive, Ubiquitous, Service-Oriented, and Cloud Computing
Collaborative, Distributed, Embedded, Real-Time, High Performance, Highly Dependable, Intelligent, Multimedia Systems
Big Data and Storage
Prognostics and Health Management
IoT, Supply Chain, Cyber-Physical Systems, Industry 4.0, and Smart City
Empirical Studies, Benchmarking, and Industrial Best Practices
Applications and Tools and Automation
Approaching Artificial Creativity
最后更新 Dou Sun 在 2023-05-03
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| 全称 | 影响因子 | 出版商 |
|---|---|---|
| IEEE Wireless Communications | 11.5 | IEEE |
| ACM Transactions on Interactive Intelligent Systems | 3.600 | ACM |
| Analog Integrated Circuits and Signal Processing | 1.200 | Springer |
| Journal of Computer Networks and Communications | 2.000 | Hindawi |
| Neural Computing and Applications | 4.500 | Springer |
| Journal of Computer-Aided Molecular Design | 3.000 | Springer |
| International Journal of Advances in Intelligent Informatics | Universitas Ahmad Dahlan | |
| Progress in Artificial Intelligence | 2.000 | Springer |
| IEEE Transactions on Multi-Scale Computing Systems | IEEE | |
| Natural Language Engineering | 2.500 | Cambridge University Press |