会议信息
AWMM 2020: Asia Workshop on Modeling and Mechatronics
http://www.apmie.org/AWMM/awmm.html截稿日期: |
2020-09-20 Extended |
通知日期: |
2020-10-05 |
会议日期: |
2020-10-23 |
会议地点: |
Shenzhen, China |
浏览: 9068 关注: 0 参加: 1
征稿
AWMM 2020 was cancelled
最后更新 Max Chen 在 2020-08-31
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|---|---|---|---|---|---|---|---|
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| b | b1 | CPM | Annual Symposium on Combinatorial Pattern Matching | 2015-02-02 | 2015-03-31 | 2015-06-28 | |
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| 简称 | 全称 | 截稿日期 | 会议日期 |
|---|---|---|---|
| ISNN | International Symposium on Neural Networks | 2020-05-01 | 2020-10-01 |
| IComputation | IEEE Symposium on Immune Computation | 2019-07-10 | 2019-12-06 |
| ICISE' | International Conference on Information Systems Engineering | 2023-10-10 | 2023-12-16 |
| CPM | Annual Symposium on Combinatorial Pattern Matching | 2015-02-02 | 2015-06-28 |
| IH & MMSEC | ACM Workshop on Information Hiding and Multimedia Security | 2024-02-16 | 2024-06-24 |
| ICSMM | International Conference on Sensors, Materials and Manufacturing | 2021-07-05 | 2021-11-19 |
| GCAT | IEEE Global Conference for Advancement in Technology | 2021-06-07 | 2021-10-01 |
| i3D | ACM SIGGRAPH Symposium on Interactive 3D Graphics and Games | 2021-12-22 | 2022-05-03 |
| RACE | Asia-Pacific Conference on Robotics, Automation and Communication Engineering | 2020-05-30 | 2021-07-20 |
| ICSES | International Conference on Signals and Electronic Systems | 2014-06-30 | 2014-09-11 |
相关期刊
| CCF | 全称 | 影响因子 | 出版商 | ISSN |
|---|---|---|---|---|
| Microelectronic Engineering | 2.523 | Elsevier | 0167-9317 | |
| IEEE/ASME Transactions on Mechatronics | 4.943 | IEEE | 1083-4435 | |
| Applied Computational Intelligence and Soft Computing | Hindawi | 1687-9724 | ||
| Journal of Systems Engineering and Electronics | Beijing Institute of Aerospace Information | 1004-4132 | ||
| Advances in Power Electronics | Hindawi | 2090-181X | ||
| Electronics | 2.412 | MDPI | 2079-9292 | |
| Chinese Journal of Electronics | CIE | 1022-4653 | ||
| International Journal on Organic Electronics | AIRCC | 2319-4359 | ||
| Computational Mathematics and Modeling | Springer | 1046-283X | ||
| International Biomechanics | Taylor & Francis | 2333-5432 |
| 全称 | 影响因子 | 出版商 |
|---|---|---|
| Microelectronic Engineering | 2.523 | Elsevier |
| IEEE/ASME Transactions on Mechatronics | 4.943 | IEEE |
| Applied Computational Intelligence and Soft Computing | Hindawi | |
| Journal of Systems Engineering and Electronics | Beijing Institute of Aerospace Information | |
| Advances in Power Electronics | Hindawi | |
| Electronics | 2.412 | MDPI |
| Chinese Journal of Electronics | CIE | |
| International Journal on Organic Electronics | AIRCC | |
| Computational Mathematics and Modeling | Springer | |
| International Biomechanics | Taylor & Francis |
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