Información de la conferencia
CLOUD 2024: International Conference on Cloud Computing
https://cloud.conferences.computer.org/2024Día de Entrega: |
2024-03-17 |
Fecha de Notificación: |
2024-05-06 |
Fecha de Conferencia: |
2024-07-07 |
Ubicación: |
Shenzhen, China |
Años: |
17 |
Vistas: 32867 Seguidores: 54 Asistentes: 12
Solicitud de Artículos
IEEE CLOUD is the flagship conference focusing on innovative cloud computing across all ” Everything as a service” paradigms (XaaS). This includes modeling, designing, developing, publishing, monitoring, managing, operating, delivering, and scaling XaaS offerings from the cloud to the edge. The conference is a prime international forum for researchers, academics, businesses, industry, and standard bodies to exchange the latest fundamental advances in the state of the art and practice of cloud computing, identify emerging research topics, and define the future of cloud computing. IEEE CLOUD 2024 invites original papers addressing all aspects of cloud computing infrastructure, applications, and business innovations. Topics of interest include but are not limited to the following: Cloud and AI Cloud Computing for AI (LLMs, distributed machine learning, federated learning, etc.) AI for the Cloud (predictive analysis, anomaly detection, automation for load balancing, remediation, and migration) Use of Cloud to Improve AI Research and Deployment and Automation for Remediation & Mitigation Observability, Transparency, and Reproducibility Infrastructure Cloud Computing Systems and Data Center Architectures Cloud-Centric Network Architectures (SDN, NFV, etc) Cloud-Native Programming Models (Serverless, Microservices, Containers, etc.) Virtualization, Containers, and Virtual Machines Cloud Storage Multi-Tenancy in the Cloud Edge and Fog Computing Infrastructure Internet-of-Things Infrastructure and Cyber-Physical Systems Cloud-based Applications Large-Scale Cloud Applications Machine Learning, Deep Learning, and LLM Applications Distributed Ledger Applications IoT Applications Mobile Applications Digital Twins & Metaverse Applications Cloud Management and Operations Hybrid-Cloud Integration Multi-Cloud Environments Inter-Cloud Inoperability Distributed and Parallel Query Processing Resource Management Cloud Metering and Monitoring Energy Efficiency, Sustainability, and Management Fault Tolerance, High availability, and Reliability Cloud Service Adaptation and Automation Cloud Federation, Service Composition Sustainable Cloud Computing Cloud Security Confidential Cloud Computing and Trusted Cloud Environments Access Control, Authorization, and Authentication Assurance, Audit, Certification, Compliance Privacy-aware Data Management Cross Data Center and Data Management Cloud Economics Cloud Strategy for Enterprise Business Transformation Cloud Service Level Agreement (SLAs) Economics and Business Models for XaaS Cloud Quality Management Cloud ROI Analysis, Cost, and Pricing Cross Cloud Data Market and Trading Cloud Service Delivery Infrastructure as a Service (IaaS) Platform as a Service (PaaS) Function as a Service (FaaS) Software as a Service (SaaS) Network / Storage as a Service Machine Learning as a Service LLM as a Service Cloud Computing Paradigms Quantum Cloud Computing Sky Computing Edge Cloud Computing Mobile Cloud Computing Satellite Cloud Computing Computing Continuum and Edge-Cloud-HPC Federation
Última Actualización Por Dou Sun en 2023-12-24
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Revistas Relacionadas
CCF | Nombre Completo | Factor de Impacto | Editor | ISSN |
---|---|---|---|---|
IEEE Transactions on Haptics | 2.400 | IEEE | 1939-1412 | |
c | Multimedia Systems | 3.500 | Springer | 0942-4962 |
Computers & Mathematics with Applications | 2.900 | Elsevier | 0898-1221 | |
Integrated Computer-Aided Engineering | 5.800 | IOS Press | 1069-2509 | |
Journal of Digital Imaging | 2.900 | Springer | 0897-1889 | |
Intelligence & Robotics | OAE Publishing | 2770-3541 | ||
c | BMC Bioinformatics | 2.900 | BioMed Central | 1471-2105 |
Active and Passive Electronic Components | 1.300 | Hindawi | 0882-7516 | |
Ethics and Information Technology | 3.400 | Springer | 1388-1957 | |
c | EURASIP Journal on Information Security | 2.500 | Springer | 1687-417X |
Nombre Completo | Factor de Impacto | Editor |
---|---|---|
IEEE Transactions on Haptics | 2.400 | IEEE |
Multimedia Systems | 3.500 | Springer |
Computers & Mathematics with Applications | 2.900 | Elsevier |
Integrated Computer-Aided Engineering | 5.800 | IOS Press |
Journal of Digital Imaging | 2.900 | Springer |
Intelligence & Robotics | OAE Publishing | |
BMC Bioinformatics | 2.900 | BioMed Central |
Active and Passive Electronic Components | 1.300 | Hindawi |
Ethics and Information Technology | 3.400 | Springer |
EURASIP Journal on Information Security | 2.500 | Springer |
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