会議情報
EPTC 2018: Electronics Packaging Technology Conference
https://www.eptc-ieee.net/
提出日:
2018-07-27 Extended
通知日:
2018-08-15
会議日:
2018-12-04
場所:
Singapore
年:
20
閲覧: 10141   追跡: 0   出席: 0

論文募集
CONFERENCE TOPICS 

    Advanced Packaging: Advanced Flip-chip, 2.5D & 3D,PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter-wave, Power and Rugged Electronics Packaging etc.
    TSV/Wafer Level Packaging: Wafer level packaging ( Fan in/Fan out), embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
    Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb-free) etc.
    Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
    Materials and Processing: advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, Leadframes, PCB etc for advanced packaging, and assembly processes using advanced materials.
    Equipment and Process Automation: new processes development, equipment automation, equipment hardware development/ improvements, data analytics, in-situ metrology.
    Electrical Simulations & Characterization: Power plane modeling, signal integrity analysis of package. 2D/2.5D/3D package level high-speed signal design, characterization and test methodologies, etc.
    Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, shock and drop modeling, Chip-package interaction, etc.
    Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component, system and product level thermal management and characterization.
    Quality, Reliability & Failure Analysis: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
最終更新 Dou Sun 2018-07-23
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関連仕訳帳
CCF完全な名前インパクト ・ ファクター出版社ISSN
Optics and Lasers in Engineering4.836Elsevier0143-8166
IEEE Transactions on Learning Technologies2.315IEEE1939-1382
Journal of Materials Processing Technology5.551Elsevier0924-0136
Journal of Object TechnologyEtH Zurich1660-1769
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Biometric Technology Today Elsevier0969-4765
完全な名前インパクト ・ ファクター出版社
Optics and Lasers in Engineering4.836Elsevier
IEEE Transactions on Learning Technologies2.315IEEE
Journal of Materials Processing Technology5.551Elsevier
Journal of Object TechnologyEtH Zurich
Language Learning & Technology2.571University of Hawaii Press
Electronic Journal of e-LearningAcademic Publishing Limited
Journal of Electronic Testing0.454Springer
Information Systems Frontiers0.851Springer
International Journal of Imaging Systems and Technology1.254Wiley-Blackwell
Biometric Technology Today Elsevier
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