Conference Information

ICDESA 2014: International conference on VLSI Design, Embedded Systems and Applications

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ICDESA
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Submission Date:
2014-07-11 Extended
Notification Date:
2014-07-16
Conference Date:
2014-08-25
Location:
Ostrava, Czech Republic
Viewed: 20284   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

42.3 / 100
Ranked #4,069 of 5,682 conferences · Top 72%

#266 of 341 in Systems & Architecture

Limited evidence: this conference is not listed in CCF / ICORE / QUALIS and has no acceptance-rate data on file, so most of the score falls back to the neutral baseline.
Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%) No data - scored at the neutral baseline of 50 —
Community attention (10%)
10
Public record completeness (15%)
25

Inputs used: Researchers who opened this page in the past 24 months: 3

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 25% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-14

Call For Papers

ICDESA 2014 (International conference on VLSI Design, Embedded Systems and Applications) is an academic conference held in Ostrava, Czech Republic on 2014-08-25. The paper submission deadline is 2014-07-11 (extended). Acceptance notifications are sent on 2014-07-16.

ICDESA2014 is now accepting manuscript submissions. Prospective authors are invited to submit their draft full paper to Email: [email protected] or by Easychair https://www.easychair.org/conferences/?conf=icdesa2014. The submitted paper can be in MS WORD format or PDF format. Please click to download the Paper Format for the Conference Each paper submitted to ICDESA2014 conference will be sent to at least two reviewers that include members of the International Program Committee, members of the Technical Committee, and additional qualified reviewers. The main topics of interest for this track include but will not be limited to the following. Topic T1 VLSI Design VLSI Design and Implementation Analog and RF mixed signal design Synthesis, DFT and test Simulation Verification Design for manufacturability and yield Power analysis and low-power design Thermal analysis and temperature aware design Physical design, packaging and board design CAD, CMOS sensors and MEMS nanoscale computing and nano-electronics High performance computing Multi-core and parallel architectures Networks-on-chip. T2 Embedded Systems and Applications Embedded system architecture Embedded hardware support Real-time systems Embedded software Hardware/software co-design Testing techniques Embedded computing education Embedded Engineering Image and Video processing Reconfigurable systems Applications in DSP Communications, encryption Hybrid systems-on-chip Embedded software tools case studies, ESL design flows Software Architectures Pervasive Embedded Devices Micro and Nanotechnology Low-Power Electronics Embedded Robotics RFID Applications NOTE: Other related topics are also welcome.
Last updated by Dou Sun on

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