Basic Information
Name: Joy Li
Institution: Multidisciplinary Digital Publishing Institute
Registration: 2021-09-03
Score: 350
CV
I am currently working in Electronics-MDPI as Section Managing Editor. 
E-Mail: joy.li@mdpi.com
Twitter: @Joy65703263 @ElectronicsMDPI
Linkedin: @Electronics MDPI @Joy Li
Electronics (https://www.mdpi.com/journal/electronics)
Electronics indexed within Scopus, SCIE (Web of Science), CAPlus / SciFinder, Inspec, and many other databases.
Impact Factor 2020: 2.397
CiteScore 2020 (Scopus): 2.7
New Journal Awards are Open for Applications:
https://www.mdpi.com/journal/electronics/awards
We look forward to establishing cooperation with scholars from all over the world.

Conference collaboration:
1. MCSoC 2021: International Symposium on Embedded Multicore/Many-core Systems-on-Chip: https://www.mcsoc-forum.org/
2. the World Engineers Summit (WES) 2021: www.wes-ies.org
3. BIA 2021: International Conference on Biomedical Innovations and Applications: http://biaconf.tu-varna.bg/
4. 11th International Conference & Exhibition on Green Flexible & Printed Electronics Industry: http://www.ltfn.gr/conference/
5. 2022 2nd Power System And Green Energy Conference ( PSGEC 2022): https://www.psgec.org/

These special issues are now open for submission. Welcome your valuable contributions and please feel free to contact Joy Li  if you have any inquires about these Special Issues.

1. Recent Advances on Intelligent Multimedia Networks
Website: https://www.mdpi.com/journal/electronics/special_issues/multimedia_networks
Submission Deadline: 31 March 2022.

2. Flexible Devices and Optoelectronics Technologies
Website: https://www.mdpi.com/journal/electronics/special_issues/Flexible_Optoelectron
Submission Deadline: 31 March 2022.

3. Wearable Antennas for 5G, IoT, and Medical Applications
Website: https://www.mdpi.com/journal/electronics/special_issues/wearable_antenna
Submission Deadline: 1 April 2022.

4. Advanced Machine Learning for Intelligent Robotics
Website: https://www.mdpi.com/journal/electronics/special_issues/intell_rob
Submission Deadline: 30 April 2022.

5. AI & IoT Assisted Emerging Cutting-Edge Research Areas for Industry 4.0 & Industry 5.0 Sustainability
Website: https://www.mdpi.com/journal/electronics/special_issues/AI_IoT_Industry
Submission Deadline: 30 April 2022.

6. Circuits and Optoelectronics for Point-of-Care Medical Devices
Website: https://www.mdpi.com/journal/electronics/special_issues/poc_med_devices
Submission Deadline: 22 May 2022.

7. Recent Advances in Microelectronics Devices and Integrated Circuit
Website: https://www.mdpi.com/journal/electronics/special_issues/microelectron_devices_integr_circuits
Submission Deadline: 31 May 2022.

8. Metastructures and Antennas with Enhanced Properties for Modern Microwave and Millimeter-Wave Applications
Website: https://www.mdpi.com/journal/electronics/special_issues/metastructures_antennas
Submission Deadline: 31 May 2022.

9. Design and Validation of Advanced Quantum Computing
Website: https://www.mdpi.com/journal/electronics/special_issues/quantum_comput
Submission Deadline: 30 June 2022.

10. Advanced Control Strategies with Applications to Biomedical and Biological Systems
Website: https://www.mdpi.com/journal/electronics/special_issues/biomed_biol_processes
Submission Deadline: 30 June 2022.

11. Design and Implementation of RF Front-Ends for Next Generation Communication Systems
Website: https://www.mdpi.com/journal/electronics/special_issues/rf_front_end
Submission Deadline: 31 October 2022.

12. Advances on Ceramic Microsystems
Website: https://www.mdpi.com/journal/electronics/special_issues/ceram_microsys
Submission Deadline: 31 December 2022.

13. Computer-Aided Design for Integrated Circuits and Systems
https://www.mdpi.com/journal/electronics/special_issues/CAD_Circuits_System
Submission Deadline: 31 January 2023
Tracked Conferences
CCFCOREQUALISShortFull NameSubmissionNotificationConference
CEVVEInternational Conference on Electric Vehicle and Vehicle Engineering2022-07-152022-07-252022-08-15
SoCAVInternational Symposium on Connected and Autonomous Vehicles2022-04-252022-04-302022-05-20
BIAInternational Conference on Biomedical Innovations and Applications2022-03-212022-04-152022-06-02
MCSoCInternational Symposium on Embedded Multicore/Many-core Systems-on-Chip2021-06-252021-07-302021-12-20
Attend Conferences
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Tracked Journals
CCFFull NameImpact FactorPublisherISSN
Electronics2.412MDPI2079-9292
Full NameImpact FactorPublisher
Electronics2.412MDPI
Followed Researchers
NameInstitutionRegistrationScore
Dou SunConference Partner2011-02-24110764
Samantha WangMultidisciplinary Digital Publishing Institute2021-09-0331
Nori XuMultidisciplinary Digital Publishing Institute2021-09-033
NameInstitutionScore
Dou SunConference Partner110764
Samantha WangMultidisciplinary Digital Publishing Institute31
Nori XuMultidisciplinary Digital Publishing Institute3
Tracked Jobs
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Viewed Conferences
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Viewed Journals
CCFFull NameImpact FactorPublisherISSN
StandardsMDPI2305-6703
Bioscience & Engineering: An International JournalAIRCC2349-848X
IEEE Internet of Things MagazineIEEE2576-3180
IEEE Communications Standards MagazineIEEE2471-2825
Coatings2.436MDPI2079-6412
Safety Science4.877Elsevier0925-7535
Spatial Statistics2.060Elsevier2211-6753
Mathematics1.747MDPI2227-7390
ISPRS International Journal of Geo-Information2.239MDPI2220-9964
Brain Sciences3.332MDPI2076-3425
Full NameImpact FactorPublisher
StandardsMDPI
Bioscience & Engineering: An International JournalAIRCC
IEEE Internet of Things MagazineIEEE
IEEE Communications Standards MagazineIEEE
Coatings2.436MDPI
Safety Science4.877Elsevier
Spatial Statistics2.060Elsevier
Mathematics1.747MDPI
ISPRS International Journal of Geo-Information2.239MDPI
Brain Sciences3.332MDPI