期刊信息
Journal of Manufacturing Processes
http://www.journals.elsevier.com/journal-of-manufacturing-processes/
影响因子:
5.010
出版商:
Elsevier
ISSN:
1526-6125
浏览:
13990
关注:
0
征稿
Manufacturing is undergoing major transformation due to the unforeseen challenges arising from the current trend of miniaturization, the emergence of new materials and the growing interaction between biologists and engineers to learn more from nature and living objects.

Traditionally, a "top-down" approach has been used in manufacturing. Recently, engineers and scientists have begun exploring "bottom-up" approaches for manufacturing today's highly complex products. Further, these emerging processes are aimed to improve process efficiency and product quality.

The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.

Papers relevant to the scope of JMP include, but are not limited to, the following areas:
• Meso/micro/nano fabrication, including imprint lithography.
• Advanced manufacturing processes, including mechanical, chemical and thermal processes.
• Welding, joining and assembly at micro and macro scales.
• Rapid prototyping, rapid manufacturing and repair, stereolithography and other 3-D fabrication techniques that can use optical projection.
• Advanced embossing, casting, forming and molding processes at all scales.
• Mono/multilayer functional coating processes.
• Continuum and subcontinuum process modeling and simulation.
• Manufacturing process monitoring, control and automation.
• Tribology and wear issues relevant to manufacturing processes.
最后更新 Dou Sun 在 2022-01-29
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