Materials Science &Engineering R: Reports publishes the full spectrum of materials science and engineering. The journal aims to provide a high level of novelty and quality publishing both experimental and theoretical, providing general background information as well as a critical assessment on topics in a state of flux, providing a critical overview of the current issues in a well-defined area of immediate interest to materials scientists.

The journal publishes original research papers and reviews. The journal will be launching a number of Special Issues on key themes in the Materials Sciences field: such as Energy Materials; Materials for Health; Materials Discovery; Innovation for High Value Manufacturing; and Sustainable Materials development. Please note that in keeping with the very high standard of papers in the Journal, suggested manuscripts need to display a high level of novelty and quality to be considered for submission.

Special Issue on Two-dimensional Materials and Devices
Submission Date: 2024-12-31

This Special Issue on "Next-generation 2D Materials and Devices " aims to compile cutting-edge research that advances our understanding and application of advanced devices based on 2D materials.

Guest editors:

Wenwu Li

Professor. Wenwu Li
Fudan University, Shanghai, China
Email: liwenwu@fudan.edu.cn

Peng Zhou

Professor. Peng Zhou
Fudan University, Shanghai, China
Email: pengzhou@fudan.edu.cn

Mario Lanza

Associate Professor. Mario Lanza
King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia
Email: mario.lanza@kaust.edu.sa

Lin Jiang

Associate Professor. Lin Jiang
Shanghai University, Shanghai, China
Email: linjiang@shu.edu.cn

Special issue information:

The advent of novel 2D materials signals a paradigm shift in material science, offering significant potential for future information technologies in the post-Moore era. From semi-metallic and semiconductor materials to insulating variants, these materials exhibit a diverse range of types. What distinguishes these 2D materials and renders them particularly intriguing are their novel and exceptional physical properties such as electron spin properties, ferroelectric polarization properties, photoelectric response properties, and charge transport properties. Simultaneously, wafer-level and silicon-compatible fabrication processes tailored for 2D materials and devices exhibit substantial potential. Such a multifaceted array of material properties forms the bedrock of material physics, providing a robust foundation for the construction of future devices.

The remarkable properties of atomic-thin and flat two-dimensional materials, introduce a paradigm shift in device miniaturization. Field-effect transistors incorporating 2D materials and sub-nanometer scale gate structures showcase normal switching characteristics, affirming their suitability for integrated circuits. The 2D materials based memristors present an exciting avenue for advancing neuromorphic computing and memory devices. Intelligent vision systems combining controllable photodetectors with high gains have been successfully developed utilizing 2D materials. Van der Waals heterostructures, achieved by vertically stacking diverse 2D materials with high-quality interfaces, enable transformative three-dimensional integration in integrated circuits. These processes pave the way for developing multifunctional, low-power, small-sized, and highly integrated chips—an exciting prospect for the next generation of electronic devices.

Scope:

This Special Issue on "Next-generation 2D Materials and Devices " aims to compile cutting-edge research that advances our understanding and application of advanced devices based on 2D materials. We invite contributions spanning, but not limited to, the following topics:

Synthesis and optoelectronic properties: Developments in the wafer-scale synthesis techniques of novel 2D materials and investigations into the electronic band structures, carrier transport, and optical responses of various 2D materials and heterostructures.

Device Fabrication and Integration: Novel architecture, design, and fabrication of 2D electronic, optoelectronic, and quantum devices, and high-integrated systems based on these 2D devices.

Applications in Nanotechnology: Exploration of 2D materials for applications in nanoelectronics, nanophotonics, smart sensors, and sustainable energy devices.

Emerging Trends and Future Prospects: Discussions on emerging trends, challenges, and future prospects in the field of 2D materials and their impact on diverse technological applications.

Manuscript submission information:

Submission Close Date: December 31, 2024

You are invited to submit your manuscript at any time before the submission deadline. For any inquiries about the appropriateness of contribution topics, please contact the guest editors. 

The journal’s submission platform (Editorial Manager®) will be available for receiving submissions to this Special Issue on or before Jan 1, 2024. Please refer to the Guide for Authors to prepare your manuscript, and select the article type “VSI: NextGen 2D Materials & Devices” when submitting your manuscript online. Both the Guide for Authors and the submission site can be found on the Journal Homepage.  

All the submissions deemed suitable to be reviewed in accordance with journal standards. Upon its editorial acceptance, your article will go into production immediately. It will be published in the latest regular issue, while being presented on the specific Special Issue webpage simultaneously. In regular issues, Special Issue articles will be clearly marked and branded.