Conference Information

CMCM 2023: International Conference on Mathematics, Computation and Modeling

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Submission Date:
2023-03-05 Extended
Notification Date:
2023-03-15
Conference Date:
2023-03-24
Location:
Hangzhou, China
Years:
1
Viewed: 11810   Tracked: 1   Attend: 1

Conference Partner Index (CP-I)

36.5 / 100
Ranked #5,557 of 5,646 conferences · Top 99%

#68 of 69 in Mathematics & Physical Sciences

Academic recognition (35%) No data - scored at the neutral baseline of 50
Submission selectivity (20%) No data - scored at the neutral baseline of 50
Editions held (20%)
19
Community attention (10%)
15
Public record completeness (15%)
25

Inputs used: Editions on record: 1 · Researchers following it here: 1 · Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-08-30

Call For Papers

CMCM 2023 (International Conference on Mathematics, Computation and Modeling) is an academic conference held in Hangzhou, China on 2023-03-24. The paper submission deadline is 2023-03-05 (extended). Acceptance notifications are sent on 2023-03-15.

【EI核心/Scopus/CPCI检索】2023年数学、计算和建模国际会议(CMCM 2023) 2023 International Conference on Mathematics, Computation and Modeling (CMCM 2023) 【会议官网】:http://www.cmcm2023.net/ 【会议地点】:杭州,中国 【会议日期】:2023年3月24-26日 *【出版与检索】: ★该会议接受的所有文章将发表在CMCM 2023会议论文集里,由IOP Publishing出版在Journal of Physics: Conference Series (ISSN: 1742-6596),并提交EI核心, Scopus (Elsevier), CPCI-S (ISTP)和Inspec (IET)检索。 *【投稿方式】: 线上投稿系统: https://www.morressier.com/call-for-papers/63513f50ec1c6f001a014468 投稿指南: http://www.cmcm2023.net/submission.html *【联系方式】: 会议官网: http://www.cmcm2023.net/ 会议邮箱: [email protected] 电话咨询:13502461341(微信同号) QQ咨询:2056773349 若您有任何投稿或参会的疑问,请随时联系我们,您将得到最及时细致的回复。 *【会议简介】: 2023年数学、计算和建模国际会议(CMCM 2023)将于2023年3月24-26日在中国杭州举行。该会议由国际计算机应用技术学会举办,印度工程师技术研究所赞助。 在即将举行的该次会议上,我们邀请到学术领域的知名教授将与参会者分享在数学、计算和建模领域的最新创新和研究成果。会议将主要以知名专家的主题演讲和作者的同行评审的论文报告为特色。此外,还将为参会者安排社交活动或学术访问,以促进该领域研究人员之间的交流、讨论与合作。 所有论文必须用英文撰写,并由大会技术委员会进行同行评审,所有被录用的论文将发表在会议论文集里,并提交EI核心和Scopus检索。 *【大会主讲嘉宾】: Prof. Witold Pedrycz, University of Alberta, Canada (IEEE Life Fellow) Prof. Assaf Schuster, Israel Institute of Technology, Israel (IEEE Fellow / ACM Fellow) Prof. Charles Robert Telles, Universidade Federal do Paraná, Brazil Prof. HAI DINH, Kent State University, USA Assoc. Prof. Bei WU, Northwestern Polytechnical University, China *【征稿主题】: 纯粹数学 应用数学 计算数学 科学与工程中的数学方法 数学建模 经济与保险数学模型 模拟与建模中的数学与数值方法 并行和分布式计算 计算核的算法方法及其应用 作为科学范式的计算应用 复杂网络中的计算 计算力学,经济学,金融学和统计学 计算物理,化学,生物和医学 计算统计数据 混合计算方法 仪表和测量 建模与仿真 建模和识别 建模与控制理论 系统非功能特性建模 系统建模与仿真技术 通用建模语言的设计 模型转换,模型演化 分子生物学模拟与建模 仿真在工业中的应用 工业、商业和服务业的模拟 形式化建模,验证和验证,分析,测试 (更多会议主题: http://www.cmcm2023.net/topic.html) *【投稿须知】: 1.会议的官方语言为英语,请务必用英语撰写论文。 2.请严格按照模板的格式修改文章格式(最好是在模板的基础上替换原文内容)。 3.文章页数要求不少于5页。 4.审稿周期为1-2周左右。 5.论文应为原创文章且从未公开发表,禁止抄袭,禁止一稿多投。 6.论文模板下载(WORD版本/Latex版本) 7.投稿后1-2周内出结果,审核快的话,7天之内就能出结果,早投稿早审核,早发录用通知。
Last updated by Linda Ye on

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