Información de la conferencia
ACP 2024: Asia Communications and Photonics Conference
https://www.acpconf.com/Día de Entrega: |
2024-08-01 |
Fecha de Notificación: |
|
Fecha de Conferencia: |
2024-11-02 |
Ubicación: |
Beijing, China |
Años: |
5 |
Vistas: 16067 Seguidores: 0 Asistentes: 8
Solicitud de Artículos
The submission will be made via the on-line submission system. Go to the system from the Button at the top of this page. Procedure on the system is as follows: You can either login to your existing account in the System or If you don't have an account you can create a new one at this time. This account is used to login in the system, so that you are able to submit your abstract and register for this conference. After login in System, click "International Conference" tab on the top to find The Asia Communications and Photonics Conference (ACP) / Information Photonics and Optical Communications (IPOC) Submit your abstract and manuscript. You can add another submission or edit the previous submission by logging in your account until the submission deadline. Note: The paper which is NOT presented at the conference will NOT be cited on IEEE Xplore. Track 1: Optical Fibers and Fiber-based Devices Track 2: Optical Transmission Sub-systems, Systems and Technologies Track 3: Network Architectures, Management and Applications Track 4: Optoelectronic Devices and Integration Track 5: Microwave Photonics and Optical Signal Processing Track 6: LEDs, Photovoltaics, and Optoelectronics in Energy Track 7: Optical Sensors and Biophotonics Track 8: Micro-, Nano-, and Quantum Photonics: Science and Applications
Última Actualización Por Dou Sun en 2024-06-29
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Nombre Completo | Factor de Impacto | Editor |
---|---|---|
International Journal of Computational Geometry and Applications | World Scientific | |
Computers & Fluids | 2.500 | Elsevier |
International Journal of Security, Privacy and Trust Management | AIRCC | |
IEEE Networking Letters | IEEE | |
IEEE Systems, Man, and Cybernetics Magazine | 1.900 | IEEE |
Applicable Algebra in Engineering, Communication and Computing | 0.600 | Springer |
Mobile Networks and Applications | 2.300 | Springer |
Journal of Molecular Graphics and Modelling | 2.700 | Elsevier |
Microelectronics Reliability | 1.600 | Elsevier |
IEEE Solid-State Circuits Magazine | IEEE |
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