Conference Information
EdgeCom 2021: IEEE International Conference on Edge Computing and Scalable Cloud
http://www.cloud-conf.net/cscloud/2021/ssc/index.html
Submission Date:
2021-04-20 Extended
Notification Date:
2021-05-02
Conference Date:
2021-06-26
Location:
Washington DC, USA
Years:
7
Viewed: 4895   Tracked: 3   Attend: 0

Call For Papers
Nowadays, edge computing techniques are universally used and become more powerful. The edge devices are well developed such as mobile phones, wearable devices, and IoT devices. Today edge computing has evolved to a new computing paradigm where computing tasks are completed closer to data sources (i.e. at edge) rather than in a centralized location (e.g. in cloud). Compared with cloud computing, edge computing has many advantages: 1) Services can be done without network access. 2) Users can choose not to upload private data in exchange of cloud services. 3) Real-time service with extremely low latency is possible without the overhead of moving data to the cloud. However, the restricted resources (e.g., computation, DRAM space, and battery) of edge devices bring many new challenges to edge computing as well.

IEEE Edgecom 2021 provides a forum for researchers and engineers from academia and industry to present innovative research and best practices in edge computing, discuss the opportunities and challenges that arise from rethinking cloud computing architectures and embracing edge computing. We aim to collect the latest achievements and exchange research ideas in the domains of intelligent data and security at this academic event. Joining IEEE EdgeCom 2020 will be a great opportunity for your to reach academics, professionals, and vendors who have the same research interests as yours. IEEE EdgeCom 2021 is the next edition of a series of successful academic events, including IEEE EdgeCom 2020 (New York, USA), IEEE EdgeCom 2019 (Paris, France), IEEE EdgeCom 2018 (Shanghai, China), IEEE EdgeCom 2017 (New York, USA), IEEE EdgeCom 2016 (Beijing, China), and IEEE EdgeCom 2015 (New York, USA).

The conference proceedings will be submitted to IEEE Xplore.
Last updated by Dou Sun in 2021-04-11
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