Conference Information
ICICM' 2026: International Conference on Integrated Circuits and Microsystems
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Submission Date:
2026-05-30
Notification Date:
2026-06-30
Conference Date:
2026-10-16
Location:
Xi an, China
Years:
11
Viewed: 29090   Tracked: 2   Attend: 1

Call For Papers
Topics (related to the below topics, but not only limited)

    Track 1: Electronic Design Automation (EDA)
        Progress of EDA algorithms
        EDA for emerging technologies
        Hardware-software co-design with EDA
        EDA in High Performance Computing (HPC)
        EDA in analog and mixed-signal design
        Security and reliability in EDA
        Open Source EDA Initiative
        EDA and Internet of Things (IoT)
        EDA for FPGA and ASIC design
        EDA in the automotive industry

    Track 2: Integrated Circuit and System Design
        Digital, analog, mixed-signal IC and SOC design technology
        IC computer-aided design technology, DFM
        Modeling and simulation

    Track 3: Semiconductor Devices and Circuits
        Components and circuits for wireless systems
        Low power, RF devices and circuits
        Silicon/Germanium Devices and Device Physics
        Compound semiconductor devices and circuits
        Non-traditional and nanoelectronics
        Organic semiconductor devices and technologies
        Photonics and optoelectronics

    Track 4: Process Technology and Manufacturing
        Silicon integrated circuits and manufacturing
        Interconnect, low-K, high-K and other process technologies
        Packaging and testing technology, equipment technology
        3D integration and advanced packaging
        Chiplet technology

    Track 5: Microelectromechanical systems (MEMS) and sensors
        THz and microwave microsystems
        Displays, sensors and MEMS
        Energy harvesting and wireless sensors
        BioMEMS and biomedical sensors

    Track 6: Intelligent System Design
        Software and hardware co-design
        AI digital and analog software and hardware optimization
        System-on-chip multi-objective optimization
        GPU, TPU, DPU and dedicated AI accelerator space design optimization

    Track 7: Energy sources and storage
        Solar cells and other new energy equipment
        Advanced storage technologies (Flash, FeRAM, PCM, ReRAM, MRAM, etc.)
        Batteries and energy storage systems

    Track 8: Applications and other topics
        Communications ASICs and systems
        Artificial Intelligence and Machine Learning in IC and System Design
        Quantum computing and quantum electronics

    Track 9: IC for Security and Security for IC
        Hardware-intrinsic security primitives (e.g., PUF, TRNG, PQC/FHE/NTT)
        Architectural and microarchitectural attacks and defenses
        Secure system-on-chip (SoC) architecture
        Trusted platform modules and hardware virtualization
        Side-channel attacks and countermeasures
        Hardware IP core protection and trust for consumer electronics systems and IoT
        Security and trust of AI/ML, and AI/ML for hardware security
        Hardware-assisted cross-layer security
        Emerging nanoscale technologies in hardware security applications
Last updated by Dou Sun in 2026-05-10
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