Conference Information

ICCSD 2026: International Conference on Circuits, Systems and Devices

Please Login to view website of conference
Free account: view official websites, track deadlines, and get email reminders.
Login Register

Submission Date:
2026-07-10 Due in 22 days
Notification Date:
2026-08-10
Conference Date:
2026-11-13
Location:
Ningbo, China
Years:
6
Viewed: 16553   Tracked: 1   Attend: 0

Call For Papers

ICCSD 2026 (International Conference on Circuits, Systems and Devices) is an academic conference held in Ningbo, China on 2026-11-13. The paper submission deadline is 2026-07-10. Acceptance notifications are sent on 2026-08-10.

ICCSD will provide a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Circuits, Devices and Systems. Topics for submission include, but are not limited to: Advanced Transistors（GAAFETs/ VSAFETs） Wide Bandgap Semiconductor Devices Quantum Devices Compound Semiconductor Devices Spintronic Devices Insulated-Gate Bipolar Transistor (IGBT) Power MOSFET Silicon Carbide（SiC） Nano Energy Devices Energy Conversion Devices Energy Harvesting Technology DC-DC Converter Power Management & Energy Efficient Technology Bio/Gas/Thermal/Voltage/Current Sensors Vision Intelligence & Image Sensors Acoustic Sensors Display Technology & Devices Photoelectric Conversion & Optical Fiber Sensing Power Amplifiers Mixer & Microwave Sources Terahertz Devices Magnetic Devices Electromagnetic Components Antenna Design Terahertz Sensing and Imaging Computational Electromagnetics System in Package（SiP） Through Glass Via & Through Silicon Via 3D Integration Technology High Density Packaging CAD Tools for Packing Microelectromechanical Systems Photoelectric Fusion Module Chiplets Based Microsystems Wafer-Scale Integration & System on Wafer Nonvolatile Memory Computing in Memory Emerging Memory Technologies Clock Generator and Management Physical Modeling for VLSI Design Placement & Routing Algorithm Evaluation Methods for VLSI Reliability Aging Prediction & Mitigation
Last updated by Dou Sun on

People who viewed this also viewed

Related Conferences

CCFCOREQUALISShortFull NameSubmissionNotificationConference
aa*a1SIGIRInternational Conference on Research and Development in Information Retrieval2026-01-152026-04-022026-07-20
aa*a1AAAIAAAI Conference on Artificial Intelligence2026-07-212026-11-302027-02-16
aa*a1CVPRIEEE Conference on Computer Vision and Pattern Recognition2025-11-062026-02-202026-06-03
bba1ICRAInternational Conference on Robotics and Automation2025-09-152026-06-01
aa*a1IJCAIInternational Joint Conference on Artificial Intelligence2026-01-312026-08-15
aa*a1STOCACM Symposium on Theory of Computing2025-11-042026-02-012026-06-22
cba2ICCInternational Conference on Communications2025-10-132026-01-122026-05-24
caa2IJCNNInternational Joint Conference on Neural Networks2025-01-152025-03-312025-06-30
bba1ICASSPInternational Conference on Acoustics, Speech and Signal Processing2026-09-162027-01-132027-05-16
ba*a1PODSACM SIGMOD Conference on Principles of DB Systems2026-12-032027-03-012027-06-13

Related Journals

CCFFull NameImpact FactorPublisherISSN
IET Circuits, Devices & Systems1.000IET1751-858X
Circuits, Systems, and Signal Processing2.0Springer0278-081X
IEEE Circuits and Systems Magazine4.2IEEE1531-636X
bIEEE Transactions on Multimedia9.7IEEE1520-9210
cKnowledge-Based Systems7.2Elsevier0950-7051
bSoftware & Systems Modeling3.2Springer1619-1366
aIEEE Transactions on Computers3.8IEEE0018-9340
cFuture Generation Computer Systems6.1Elsevier0167-739X
cNeurocomputing6.5Elsevier0925-2312
cPattern Recognition Letters3.9Elsevier0167-8655

Comments 0

No comments yet.

Please Login to post a comment

Advertisement