Conference Information
ISQED 2015 : International Symposium on Quality Electronic Design
Submission Date:
2014-10-17 Extended
Notification Date:
Conference Date:
Santa Clara, California, USA
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Conference Location
Call For Papers
A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, design and EDA. Authors are invited to submit papers in the various disciplines of high level design, circuit design (digital, analog, mixed-signal, RF), test & verification, design automation tools; processes; flows, device modeling, semiconductor technology, advance packaging, and biomedical & bioelectronic devices. All past Conference proceedings & Papers have been published in IEEE Xplore digital library and indexed by Scopus.

    Electronic Design
        System-level Design, Methodologies & Tools
        IOT & Smart Sensors - Technology and Design
        FPGA Architecture, Design, and CAD
        IC Package - Design Interactions & Co-Design
        Advanced 3D ICs & 3D Packaging
        Robust & Power-conscious Circuits & Systems
        Emerging/Innovative Process & Device Technologies and Design Issues
        Design of Reliable Circuits and Systems
        Design of Embedded Systems
    Design Automation and IP
        IP Design, quality, interoperability and reuse
        Design Verification and Design for Testability
        Physical Design, Methodologies & Tools
        EDA Methodologies, Tools, Flows
    Manufacturing, Semiconductor Process and Devices
        Design for Manufacturability/Yield & Quality
        Effects of Technology on IC Design, Performance, Reliability, and Yield
    Hardware and System Security (NEW in ISQED 2015)

The details of various topics of paper submission is as follows:

Hardware and System Security (HSS)

Hardware security attacks and defenses. Side-channel attacks and prevention. Reverse engineering and hardware obfuscation. Hardware tamper and Trojan detection. Hardware authentication and attestation. Hardware-based security primitives including PUFs, TRNGs and ciphers. Security, privacy, and trust protocols using hardware security primitives. Trusted information flow using integration of architecture and hardware security primitives. Trusted synthesis using untrusted tools. Trusted manufacturing including split manufacturing, remote integrated circuit enabling and disabling, watermarking, and fingerprinting. Hardware and software usage metering techniques. Techniques and metrics for hardware system data confidentiality, hardware design confidentiality, integrity and authenticity. System security assessment techniques. Computer architecture and implementation techniques that ensure software and/ or system security. Approaches for trusted remote sensing and computing.

Smart Sensors & IoT - Design and Technology (SSDT)

Sensor and actuator devices for industrial use. Circuits and links, and their design for sensor interfaces. Energy harvesting techniques. Device, circuit, and package level modeling of sensors. Sensor calibration. Networked sensors and data processing algorithms. Sensor fusion and sensor networks. Bio-sensors. Energy management in sensor chips. Sensors for robotics. Wearable and implantable sensors. Wireless sensor networks. Environmental sensors and sensors for ambient assisted living, for building automation, for automotive applications, and for aircraft. Underlying device technologies for sensors, such as MEMS, magnetic, optical, etc. Touch screen sensors and capacitive vs. resistive sensing. Temperature sensors and arrays. Sensor Integration: Hardware & Software. Indoor positioning and navigation using inertial sensors. MEMS microphones and speakers. Chemical sensors.

System-level Design, Methodologies & Tools (SDM)

Emerging system-level design paradigms, methods and tools aiming at quality of systems including multi-core processors, embedded systems, SoC, novel accelerator designs, and heterogeneous architecture designs. ESL design process and flow management. System-level design modeling, analysis, synthesis, and estimation for correct high-quality hardware/software systems. New concepts, methods and tools addressing the hardware and system design complexity and usage of technology information and manufacturing feedback in the system-, RTL- and logic level design. The influence of the nanometer technologies' issues on the system-, RTL- and logic-level design. System-level trade-off analysis and multi-objective (e.g. yield, power, delay, area, etc.) optimization.

Package and Three-Dimensional Integration (PTDI)

Architecture, circuit, package, and PCB/PWB design and effect on quality in emerging forms of vertical integration including 3D IC, 2.5D Interposer, multi-chip module, and other innovative packaging techniques. Tools and methodologies dealing with electrical, stress, and thermal modeling and simulation for improved quality of product. Novel partitioning, power delivery design, clock tree design, heatsink/cooling methods, and design for test/yield techniques in vertically integrated circuits/chips. Design and technology solutions in system-on-chip versus system in a package (SiP) solutions. Die-package co-design and trade-off analysis.

Integrated Circuit Design (ICD)

Low power circuits, memory, analog, RF, programmable logic, and FPGA circuits. Power-aware computing and communication. Design techniques and architecture for leakage current management, total power optimization, and power management. Low power interconnect solutions. Analog-to-digital and digital-to-analog converters. Robust SRAM cell and circuits. Effect of device and process reliability, robustness, and variation on the design of reliable circuits. Circuit design for reliability effects such as gate oxide integrity, electromigration, ESD, HCI, NBTI, PBTI etc.

Emerging Process & Device Technologies and Design Issues (EDT)

Emerging processes & device technologies and implications on IC design with respect to the design's time to market, yield, reliability, and quality. Emerging issues in new and novel technologies such as Double-Gate (DG)-MOSFET, FinFETs, tunnel FETs, GAA, DSA, SWD, high-bandwidth metallization, carbon nanotubes, and nano devices. Advanced SOI technologies such as trap-rich high-resistivity SOI, etc for wireless front-end SOC implementation. Specialty technologies (eg. MEMs, CIS co-integration with application processors) for the IOT market. Device design and circuit optimization in emerging non-volatile memory and logic, such as Spin-Transfer Torque MRAM, Spintronic electronics, Phase Change Memory, Resistive RAM, and Memristors, 3D integration . Use of novel devices for cognitive computing, quantum computing, neuromorphic computing.

EDA Methodologies & IP Cores; Interoperability, Security, and Reuse (EDA)

EDA tools addressing management of design process, design flows and design databases. EDA tools interoperability issues and implications. Emerging EDA standards. EDA design methodologies and tools that address issues which impact the quality of the realization of designs into physical integrated circuits. IP modeling and abstraction. Design and maintenance of technology independent hard and soft IP blocks. Methods and tools for analysis, comparison and qualification of libraries and hard IP blocks. Challenges and solutions of the integration, testing, qualifying, and manufacturing of IP blocks from multiple vendors. Third party testing of IP blocks. Risk management of IP reuse. IP authoring tools and methodologies. Design for IP security. Novel techniques for IP water marking. Application of EDA tools to non-traditional problems such as smart power grid, Solar energy, etc.

Design Verification and Design for Testability (DVFT)

Hardware and software formal, assertion, and simulation based design verification techniques to ensure the functional correctness of hardware early in the design cycle. DFT and BIST for digital and SoC. DFT for analog/mixed-signal ICs and systems-on-chip, DFT/BIST for memories. Test synthesis and synthesis for testability. DFT economics, DFT case studies. DFT and ATE. Fault diagnosis, IDDQ test, novel test methods, effectiveness of test methods, fault models and ATPG, and DPPM prediction. SoC/IP testing strategies. Design methodologies dealing with the link between testability and manufacturing.

Physical Design, Methodologies & Tools (PDM)

Physical design for manufacturing; Physical synthesis flows for correct-by-construction quality silicon, implementation of large SoC designs. Tool frameworks and data-models for tightly integrated incremental synthesis, placement, routing, and timing analysis. Placement, optimization, and routing techniques for low-power and noise sensitivity reduction. Tool flows and techniques for antenna rule and electromigration rule avoidance and fixing. Spare-cell strategies for ECO, decoupling capacitance and antenna rule fixing. Reliable clock distribution methodologies for Gigahertz designs and near/sub-threshold designs. Physical design methodologies and tools, dealing with issues such as: timing closure, R, L, C extraction, ground/Vdd bounce, signal noise, cross-talk, substrate noise, power rail integrity, electromigration, hot carriers, EOS/ESD, plasma induced damage and other yield limiting effects, high frequency effects, thermal effects, power estimation, and EMI/EMC.

Design Technology Co-Optimization; Designing at the Manufacturing Frontier (DTCO)

Optimization-based methodologies that address the interaction between design (custom, semi-custom, ASIC, FPGA, RF, memory, etc.) and advancednode manufacturing techniques such as multiple patterning, EUV, SADP, DSA, monolithic 3D, advanced interconnect (air gap for local interconnect, Si-photonics,…), etc. DFM/DFY/DFQ definitions, methodologies, matrices, and standards. Analysis, modeling, and abstraction of manufacturing process parameters and effects for accurately predicting and/or optimizing silicon performance including reliability and aging mechanisms, variation parameters, and circuit-level analysis. Design, synthesis, and place and route of ICs considering factors such as: OPC, phase shifting, proximity correction, sub-wavelength lithography, manufacturing yield, and technology capability. Design and manufacturability issues for digital, analog, mixed signal, RF, MEMS, opto-electronic, biochemical-electronic, and nanotechnology based ICs. Redundancy and other yield improving techniques. Global, social, and economic implications of design quality. Mask making methods and advances impacting manufacturability and yield. Single event upset/transient fail analysis.

Submission of Papers

Authors should submit FULL-LENGTH, original, unpublished papers (4 pages long). To permit a blind review, do not include name(s) or affiliation(s) of the author(s) on the manuscript and abstract. Submit your papers using the on-line paper submission procedure available in the ISQED web site. Please check the as-printed appearance of your paper before submitting the paper. The guidelines for the paper format is provided in the MS Word template at the bottom of this page. Use the on-line paper submission procedure by clicking the following link: ON-LINE. If you have problem accessing the paper submission site it is located at:
Submission of Workshop/Tutorial Proposals

Several workshop/tutorial sessions will be held on the first day, and would offer valuable opportunities for practicing professionals to refresh or upgrade their skills in quality-based IC design techniques, methodologies and tools. These sessions are intended to supplement the conference by providing in depth, practical and proven design solutions. Workshops/Tutorials will be taught by experts in the field, who are intimately involved with the issues and solutions in their perspective areas, from both the industry and academia. If interested in offering tutorial, please send your tutorial proposals to the ISQED workshop/tutorial committee to isqed2015 [at] ISQED [dot] org

The proposal should include:

    Title of Workshop/Tutorial
    Name of organizer
    Name(s), address, and affiliation of the Moderator
    Name(s), address, and affiliation of presenter(s)
    Half-page summary of each presenter's biography

You may send your proposal by email as straight text or as an Adobe PDF file. The presentations must be technical, up to date, relevant, and target the design community. Marketing presentations will not be accepted. In order to meet the conference timeline, we would like to have your proposal no later than Nov. 25, 2014. Please check the the archive section of the web site for a listing of past tutorials.
Last updated by Dou Sun in 2014-10-08
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