Conference Information
HOT CHIPS 2016 : Symposium on High Performance Chips
Submission Date:
Notification Date:
Conference Date:
Cupertino, California, USA
CCF: b   CORE: a   Viewed: 6404   Tracked: 6   Attend: 1

Conference Location
Call For Papers
Areas of Interest

    General Purpose Processor Chips
        High-Performance and Low-Power
        Multi-Core and Highly-Reliable Systems
    Mobile and Embedded Devices
        SoC, Security, and DSP chips
    Communications and Networking
        Wireless LAN/WAN/PAN
        Network and IO Processors
    Other Chips
        FPGAs and FPGA-Based Systems
        Memory Technologies and Chipsets
        Custom Chips for Emerging applications
    Software for multi-Core and Heterogeneous Systems
        Programming models, Runtime Systems
        Compilers and Operating Systems
        Performance, Power Debug and Evaluation
    High Integrity Computation
        Secure architectures
        Design for validation and test
    Other Technologies
        Power and Thermal Management
        Packaging and Testing
        Display Technologies
        On-Chip Optics & Sensors
        Novel Computing Technologies

Submission Guidelines

Submissions must consist of the following and can be submitted here:

    “Presentation” or “Poster”
    Extended abstract (two pages maximum)
    Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
    Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
    Indication if you would like the submission to be held confidential.

Evaluation Criteria

Submissions are evaluated by the Program Committee on the basis of performance of the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, please indicate its status – design, development, tape out, silicon, shipping, etc.

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Poster Guidelines

Poster submissions consist of 4 slides and a one-page summary.

Program related questions/comments?

Please email our Program Committee Co-Chairs at

    Bryan Chin, Cavium
    Subhasish Mitra, Stanford University
Last updated by Dou Sun in 2016-03-20
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