Conference Information
MCSoC 2017 : International Symposium on Embedded Multicore/Many-core Systems-on-Chip
http://www.mcsoc-forum.org/
Submission Date:
2017-05-20 Extended
Notification Date:
2017-06-23
Conference Date:
2017-09-18
Location:
Seoul, Korea
Years:
11
Viewed: 2147   Tracked: 2   Attend: 0

Conference Location
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Call For Papers
The IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip aims at providing the  world’s premier forum of leading  researchers in the embedded Multicore/Many-core SoCs software, tools and  applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works.Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon  acceptance of the paper.

Program Tracks

    Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
    Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
    Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
    Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
    Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
    Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
    Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
    Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
    Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.
Last updated by Dou Sun in 2017-04-29
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